Effect of pad wear on the chemical mechanical polishing of silicon wafers

CIRP Annals - Manufacturing Technology

Volumn 48, Issue 1, 1999, Pages 143-146

  Byrne, G ^a   Mullany, B ^a   Young, P ^b  

^a UNIVERSITY COLLEGE DUBLIN   (Ireland)

^b DUBLIN CITY UNIVERSITY   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; FINITE ELEMENT METHOD; SILICON WAFERS; STRESS CONCENTRATION; SURFACES;

CHEMICAL MECHANICAL POLISHING; PAD WEAR; PLANARITY;

WEAR OF MATERIALS;

EID: 0032684315     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)63151-5     Document Type: Article

References (11)

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