Materials with tunable low-k dielectric constant derived from functionalized octahedral silsesquioxanes and spherosilicates

Polymer

Volumn 52, Issue 12, 2011, Pages 2492-2498

  Eckstorff, Felix ^a   Zhu, Yongzhong ^a   Maurer, Robert ^b   Müller, Thomas E ^a,c   Scholz, Sabine ^a   Lercher, Johannes A ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b WACKER CHEMIE AG   (Germany)

^c RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

Hardness; Low k dielectric constant; Polyhedral oligomeric silsesquioxanes (POSS)

Indexed keywords

HARDNESS; LOW-K DIELECTRIC; MONOMERS; POLYMER FILMS;

ALKOXYSILYL GROUPS; FUNCTIONALIZED; LOW DIELECTRIC CONSTANTS; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; POROGENS; SILSESQUIOXANES; SPIN COATED POLYMERS;

DIELECTRIC MATERIALS;

EID: 79956347085     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2011.01.050     Document Type: Article

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