Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength

Kovove Materialy

Volumn 48, Issue 6, 2010, Pages 353-359

  Sebo P ^a   Svec P ^b   Janickovic D ^b   Illekova E ^b  

^a INSTITUTE OF MATERIALS AND MACHINE MECHANICS   (Slovakia)

^b INSTITUTE OF PHYSICS   (Slovakia)

Author keywords

Antimony; Cu solder Cu strength; Lead free solder; Wetting

Indexed keywords

EID: 78651288632     PISSN: 0023432X     EISSN: None     Source Type: Journal    
DOI: 10.4149/km_2010_6_353     Document Type: Article

References (8)

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