Effect of indium on the microstructure of the interface between Sn3.13Ag0.74CuIn solder and Cu substrate

Journal of Alloys and Compounds

Volumn 480, Issue 2, 2009, Pages 409-415

  Šebo, Pavol ^a   Moser, Zbigniew ^b   Švec, Peter ^c   Janičkovič, Dušan ^c   Dobročka, Edmund ^d   Gasior, Wladyslaw ^b   Pstruś, Janus ^b  

^a INSTITUTE OF MATERIALS AND MACHINE MECHANICS   (Slovakia)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^c INSTITUTE OF PHYSICS   (Slovakia)

^d INSTITUTE OF CHEMISTRY   (Slovakia)

Author keywords

Copper; Interaction; Lead free solders; Phase analysis; X ray scan

Indexed keywords

CU SUBSTRATE; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; INTERACTION; LEAD-FREE SOLDERS; PHASE ANALYSIS; SEM; SPATIALLY RESOLVED X-RAY DIFFRACTIONS; X-RAY SCAN;

BRAZING; COPPER; INDIUM; LEAD; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN; WELDING; X RAY DIFFRACTION;

PHASE INTERFACES;

EID: 67349225809     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2009.02.110     Document Type: Article

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