Timing analysis and optimization for 3D stacked multi-core microprocessors

IEEE 3D System Integration Conference 2010, 3DIC 2010

Volumn , Issue , 2010, Pages

  Lee, Young Joon ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORE LEVELS; DESIGN METHODOLOGY; MULTI CORE; OVERALL DESIGN; PHYSICAL LAYOUT; TIMING ANALYSIS; TIMING CONSTRAINTS; TIMING OPTIMIZATION;

BUDGET CONTROL; MICROPROCESSOR CHIPS; OPTIMIZATION; TIMING CIRCUITS;

THREE DIMENSIONAL;

EID: 79955946162     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2010.5751444     Document Type: Conference Paper

References (8)

1. S. J. K. et al., "Wafer-level 3D integration technology," IBM Journal of Research and Development, vol. 52, no. 6, pp. 583-597, 2008.
2. J. Minz, E. Wong, M. Pathak, and S. K. Lim, "Placement and Routing for 3D System-On-Package Designs," IEEE Transactions on Components and Packaging Technologies, vol. 29, no. 3, pp. 644-657, 2006.
3. M. Pathak and S. K. Lim, "Thermal-aware Steiner Routing for 3D Stacked ICs," in Proc. IEEE Int. Conf. on Computer-Aided Design, 2007, pp. 205-211.
4. S.-M. J. et al., "Three Dimensionally Stacked NAND Flash Memory Technology Using Stacking Single Crystal Si Layers on ILD and TANOS Structure for Beyond 30nm Node," in International Electron Device Meeting, 2006, pp. 37-40.
5. V. S. et al., "Megapixel CMOS Image Sensor Fabricated in Three- Dimensional Integrated Circuit Technology," in IEEE International Solid- States Circuits Conf., 2005.
6. A. G. AB., "Leon3 Processor." [Online]. Available: http://www.gaisler.com/
7. M. Pathak, Y.-J. Lee, T. Moon, and S. K. Lim, "Through Silicon Via Management during 3D Physical Design: When to Add and How Many?" in Proc. IEEE Int. Conf. on Computer-Aided Design, 2010, to appear.
8. R. Nair, C. L. Berman, P. S. Hauge, and E. J. Yoffa, "Generation of performance constraints for layout," IEEE Transactions on Computer-Aided Design, vol. 8, pp. 860-874, Aug. 1989.