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Volumn 40, Issue 5, 2011, Pages 513-517

Thermopower study of GaN-based materials for next-generation thermoelectric devices and applications

Author keywords

GaN; GaN:Gd; III nitrides; InGaN; MOCVD; Seebeck; Thermoelectrics; thermopower

Indexed keywords

GAN; GAN:GD; III-NITRIDES; INGAN; MOCVD; SEEBECK; THERMOELECTRICS; THERMOPOWERS;

EID: 79955897444     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1416-9     Document Type: Conference Paper
Times cited : (60)

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  • 8
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    • Geballe, T.H.1    Hull, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.