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72949123476
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Development of a 10 kw high power density three-phase ac-dc-ac converter using sic devices
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sep.
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R. Lai, F. Wang, P. Ning, D. Zhang, D. Jiang, R. Burgos, D. Boroyevich, K. Karimi, and V. Immanuel, "Development of a 10 kw high power density three-phase ac-dc-ac converter using sic devices," Power Electronics and Applications, 2009. EPE '09. 13th European Conference on, pp. 1-12, sep. 2009.
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Lai, R.1
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Boroyevich, D.7
Karimi, K.8
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52349088075
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Towards an airborne high temperature sic inverter
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IEEE, jun.
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D. Bergogne, H. Morel, D. Planson, D. Tournier, P. Bevilacqua, B. Allard, R. Meuret, S. Vieillard, S. Rael, and F. MeibodyTabar, "Towards an airborne high temperature sic inverter," Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, pp. 3178-3183, jun. 2008.
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Power Electronics Specialists Conference, 2008. PESC 2008
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Meuret, R.7
Vieillard, S.8
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MeibodyTabar, F.10
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3
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84867793296
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High temperature inverter for airborne application
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F. Dubois, D. Bergogne, D. Risaletto, R. Robutel, H. Morel, R. Meuret, and S. Dhokkar, "High temperature inverter for airborne application," IMAPS HiTEC Conference, may 2010.
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IMAPS HiTEC Conference, May 2010
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Dubois, F.1
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Morel, H.5
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34547102755
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Power conversion with sic devices at extremely high ambient temperatures
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jul.
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Impact of emc filters on the power density of modern three-phase pwm converters
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jun.
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Heldwein, M.1
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Study of conducted emi reduction for three-phase vienna-type rectifier
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jun.
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D. Jiang, R. Lai, F. Wang, F. Luo, S. Wang, and D. Boroyevich, "Study of conducted emi reduction for three-phase vienna-type rectifier," Power Electronics Conference (IPEC), 2010 International, pp. 1118-1124, jun. 2010.
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Jiang, D.1
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Attenuation of conducted emi emissions from an inverter-driven motor
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jan.
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H. Akagi and T. Shimizu, "Attenuation of conducted emi emissions from an inverter-driven motor," Power Electronics, IEEE Transactions on, vol. 23, no. 1, pp. 282-290, jan. 2008.
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Power Electronics, IEEE Transactions on
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Akagi, H.1
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Emi study of a three phase inverter-fed motor drives
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vol.4, oct.
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B. Revol, J. Roudet, J. Schanen, and P. Loizelet, "Emi study of a three phase inverter-fed motor drives," Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE, vol. 4, pp. 2657-2664 vol.4, oct. 2004.
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Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE
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Revol, B.1
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Schanen, J.3
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72949104362
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Common-mode emissions measurements and simulation in variable-speed drive systems
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nov.
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C. Jettanasen, F. Costa, and C. Vollaire, "Common-mode emissions measurements and simulation in variable-speed drive systems," Power Electronics, IEEE Transactions on, vol. 24, no. 11, pp. 2456-2464, nov. 2009.
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Jettanasen, C.1
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77954752035
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Emi noise prediction for electronic ballasts
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aug.
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F. Giezendanner, J. Biela, J. Kolar, and S. Zudrell-Koch, "Emi noise prediction for electronic ballasts," Power Electronics, IEEE Transactions on, vol. 25, no. 8, pp. 2133-2141, aug. 2010.
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Giezendanner, F.1
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12
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78650085446
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Overvolatage mitigation of inverterdriven motors with long cables of different lengths
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H. Akagi and I. Matsumura, "Overvolatage mitigation of inverterdriven motors with long cables of different lengths," ECCE Conference, septembre 2010.
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ECCE Conference, Septembre 2010
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Akagi, H.1
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52349104007
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Modeling and high temperature characterization of sic-jfet
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IEEE, jun.
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R. Mousa, D. Planson, H. Morel, B. Allard, and C. Raynaud, "Modeling and high temperature characterization of sic-jfet," Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, pp. 3111-3117, jun. 2008.
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15
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72449202598
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Design considerations of a fast 0-ohm gate-drive circuit for 1.2 kv sic jfet devices in phaseleg configuration
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IEEE, sep.
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R. Burgos, Z. Chen, D. Boroyevich, and F.Wang, "Design considerations of a fast 0-ohm gate-drive circuit for 1.2 kv sic jfet devices in phaseleg configuration," Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE, pp. 2293-2300, sep. 2009.
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76649133450
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Sic wirebond multichip phase-leg module packaging design and testing for harsh environment
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jan.
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P. Ning, R. Lai, D. Huff, F. Wang, K. Ngo, V. Immanuel, and K. Karimi, "Sic wirebond multichip phase-leg module packaging design and testing for harsh environment," Power Electronics, IEEE Transactions on, vol. 25, no. 1, pp. 16-23, jan. 2010.
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33745891203
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A sic jfet driver for a 5 kw, 150 khz three-phase pwm converter
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Vol. 1, oct.
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S. Round, M. Heldwein, J. Kolar, I. Hofsajer, and P. Friedrichs, "A sic jfet driver for a 5 kw, 150 khz three-phase pwm converter," Industry Applications Conference, 2005. Fourtieth IAS Annual Meeting. Conference Record of the 2005, vol. 1, pp. 410-416 Vol. 1, oct. 2005.
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