The development of polymer-based flat heat pipes

Journal of Microelectromechanical Systems

Volumn 20, Issue 2, 2011, Pages 410-417

  Oshman, Christopher ^a   Shi, Bo ^b,c   Li, Chen ^b,d   Yang, Ronggui ^a   Lee, Y C ^a   Peterson, G P ^b,e   Bright, Victor M ^a  

^a UCB 450   (United States)

^b UNIVERSITY OF COLORADO   (United States)

^c NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^d UNIVERSITY OF SOUTH CAROLINA   (United States)

^e GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Cooling; flat heat pipe (FHP); hybrid wick; polymer

Indexed keywords

CASING MATERIALS; EFFECTIVE THERMAL CONDUCTIVITY; EXPERIMENTAL STUDIES; FLAT HEAT PIPE; FLAT HEAT PIPE (FHP); FLEXIBLE CIRCUIT; HEAT GENERATING COMPONENTS; HYBRID WICK; TEST DATA; THERMAL MANAGEMENT; THERMAL VIAS; THERMO-PHYSICAL PROPERTY; TILT ANGLE; WICKING STRUCTURE; WORKING FLUID;

ELECTRONIC EQUIPMENT MANUFACTURE; HEAT FLUX; HEAT PIPES; LIQUIDS; POLYMER FILMS; POLYMERS; PRINTED CIRCUIT BOARDS; THERMODYNAMIC PROPERTIES;

FILLED POLYMERS;

EID: 79953759956     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2107885     Document Type: Article

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