Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components

International Journal of Heat and Mass Transfer

Volumn 51, Issue 25-26, 2008, Pages 6006-6017

  Sonan, R ^a   Harmand, S ^a   Pelle J ^a   Leger, D ^a   Fakes M ^b  

^a UNIVERSITÉ DE VALENCIENNES   (France)

^b VALEO   (France)

Author keywords

Electronics; Heat pipe; Phase change; Transient

Indexed keywords

FLUID DYNAMICS; HEAT PIPES; HEAT TRANSFER; HYDRODYNAMICS; LIQUIDS; MASS TRANSFER; PHASE INTERFACES; PIPE; VAPORS;

CLAPEYRON LAWS; COOLING OF ELECTRONICS; ELECTRONICS; ELECTRONICS COMPONENTS; FLAT HEAT PIPES; FLUID FLOWS; GOVERNING EQUATIONS; HEAT AND MASS TRANSFERS; HYDRODYNAMIC MODELS; PHASE CHANGE; PHASE CHANGE MECHANISMS; START-UP; THERMAL MODELS; THROUGH THE WALLS; TRANSIENT PERFORMANCES; TRANSIENT RESPONSES; VAPOR CORES; VAPOR INTERFACES;

THREE DIMENSIONAL;

EID: 55549109018     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2008.04.071     Document Type: Article

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