Polymer micro-heat-pipe for InP/InGaAs integrated circuits

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 82-87

  Liu, Wai Y ^a   Mohammadi, Saeed ^b   Katehi, Linda P B ^b  

^a University of Michigan   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

Gelcasting; Heat pipe; Microfabrication; Polymer micromachining; SU 8

Indexed keywords

BONDING; INTEGRATED CIRCUITS; LOW TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; POLYMERS; SEMICONDUCTING INDIUM GALLIUM ARSENIDE; SEMICONDUCTING INDIUM PHOSPHIDE; SILICON WAFERS; SINTERING; BUDGET CONTROL; CAPILLARY FLOW; CHIP SCALE PACKAGES; COOLING; ELECTRONICS PACKAGING; FABRICATION; GALLIUM ARSENIDE; GALLIUM PHOSPHIDE; HEAT PIPES; HEAT SINKS; HEAT TRANSFER; INDIUM; INDIUM PHOSPHIDE; PACKAGING; TEMPERATURE; THERMAL VARIABLES MEASUREMENT;

MICRO-HEAT-PIPE; POLYMER MICROMACHINING; WAFER-TO-WAFER BONDING;

HEAT PIPES; WAFER BONDING;

HIGH TEMPERATURE; INDIUM GALLIUM ARSENIDE; LOW-TEMPERATURE INP; MICRO HEAT PIPE; ORGANIC MATERIALS; POLYMER BASED; THERMAL BUDGET; WAFER TO WAFER BONDING;

EID: 0037275134     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Wai U. Liu, Saeed Mohammadi, Linda P.B. Katehi, Hamed Khalkhali and Katsuo Kurabayashi, "Polymer Micro-heat-pipe For Inp/InGaAs Technologies", EDMO2002, pp 143-148, Nov 2002.
2. Dumbravescu, N., "Non-conventional technologies for micro-optical components: a survey", Semiconductor Conference, CAS 2000 Proceedings. International, Volume: 2, 2000.
3. Van Lerberghe, L.M.; Motsegood, K.M.; Beebe, D.J., "Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer", Microelectromechanical Systems, Journal of, Volume: 9 Issue: 1, pp 76-81, March 2000.
4. Vijay K. Varadon, Xiaoning Jiang and Vasundara V. Varadan, "Microstereolithography and other Fabrication Techniques for 3D MEMS", Wiley (England 2001)