Investigation of a novel flat heat pipe

Journal of Heat Transfer

Volumn 127, Issue 2, 2005, Pages 165-170

  Wang, Yaxiong ^a   Peterson, G P ^b  

^a Foxconn Thermal Technology   (United States)

^b RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

Cooling; Flat heat pipe; Heat transport capacity; Sintered mesh

Indexed keywords

HEAT FLUX; HEAT TRANSFER; MICROELECTRONICS; POWER CONVERTERS; PRODUCT DESIGN;

COPPER SCREENS; PROTOTYPES; THERMAL DESIGN; WICKING STRUCTURE;

HEAT PIPES;

HEAT TRANSFER;

EID: 17444400841     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1842789     Document Type: Article

References (16)

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