Thermal management through in-board heat pipes manufactured using printed circuit board multilayer technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 55-61

  Wits, Wessel ^a   Legtenberg, Rob ^b   Mannak, Jan ^b   Van Zalk, Bas ^b  

^a UNIVERSITY OF TWENTE   (Netherlands)

^b THALES NEDERLAND B V   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROMAGNETIC WAVE EMISSION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; HEAT PIPES; INDUSTRIAL ELECTRONICS; MICROELECTRONICS; OPTICAL DESIGN; PIPE; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; TECHNOLOGY; TEMPERATURE CONTROL; THERMAL VARIABLES CONTROL; THERMOELECTRICITY;

ELECTRONIC PRODUCTS; ELECTRONICS MANUFACTURING; EQUIVALENT THERMAL; EXPERIMENTAL VERIFICATION; HEAT DISSIPATING COMPONENTS; HOT SPOTTING; INTEGRATED APPROACH; INTERNATIONAL CONFERENCES; LAMINATED STRUCTURES; MINIATURE HEAT PIPES; MULTILAYER TECHNOLOGY; PCB FABRICATION; PRINTED CIRCUIT BOARD (PCB); TEMPERATURE GRADIENTS; THERMAL MANAGEMENT; THERMAL RESISTANCE;

PRINTED CIRCUIT BOARDS;

EID: 50249174426     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456432     Document Type: Conference Paper

References (8)

1. C.J.M. Lasance and R.E. Simons, "Advances in high-performance cooling for electronics", ElectronicsCooling, Volume 11, Number 4, November 2005.
2. T.P. Cotter, "Theory of Heat Pipes", Los Alamos Scientific Laboratory Report No. LA-3246-MS, 1965.
3. Y. Cao, A. Faghri and T. Mahefkey, "Micro/Miniature Heat Pipes and Operating Limitations", ASME HTD-Vol. 236, 1993, Pp. 55-62.
4. K. Jones, Y. Cao and M. Gao, "Development of Micro Heat Pipes Embedded in Laminate Substrates for Enhanced Thermal Management for Printed Wiring Boards", Report Florida International University, Miami, USA, 2002.
5. A. Faghri, "Heat Pipe Science and Technology", Taylor & Francis, New York, USA, 1995.
6. Y. Cao, M. Gao, J.E. Beam and B. Donovan, "Experiments and Analyses of Flat Miniature Heat Pipes", in Proc. IEEE Energy Conversion Engineering Conference (IECEC), Washington DC, USA, 1996, Vol. 2, pp. 1402-1409.
7. R.K. Shah and M.S. Bhatti, "Laminar Convective Heat Transfer in Ducts", in Handbook of Single-Phase Convective Heat Transfer, New York, 1987.
8. G.E. Schneider and R. DeVos, "Nondimensional Analysis for the Heat Transport Capabiity of Axially-Grooved Heat Pipes Including Liquid/Vapor Interaction", AIAA Paper No. 80-0214, 1980.