Investigation of the heel crack mechanism in Al connections for power electronics modules

Microelectronics Reliability

Volumn 51, Issue 5, 2011, Pages 965-974

  Celnikier, Y ^a,b   Benabou, L ^a   Dupont, L ^b   Coquery, G ^b  

^a Universite de Versailles Saint Quentin   (France)

^b Laboratoire des Technologies Nouvelles   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; INTEGRATED CIRCUIT INTERCONNECTS;

CRACK MECHANISM; ELECTRICAL INTERCONNECTIONS; ELECTRONIC PACKAGE; INITIAL RESIDUAL STRESS; LEAD FRAME; MODULE RELIABILITY; POWER ELECTRONICS MODULES; PROCESS IMPACT;

POWER ELECTRONICS;

EID: 79953647949     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.01.001     Document Type: Article

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