Study of wire bonding looping formation in the electronic packaging process using the three-dimensional finite element method

Finite Elements in Analysis and Design

Volumn 40, Issue 3, 2004, Pages 263-286

  Liu, D S ^a   Chao, Y C ^a   Wang, C H ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Gold wire; Heat affected zone; Loop profile; Wirebond

Indexed keywords

COMPUTER SIMULATION; ELASTOPLASTICITY; FINITE ELEMENT METHOD; HEAT AFFECTED ZONE; TENSILE TESTING;

WIREBOND;

ELECTRONICS PACKAGING;

EID: 0242607920     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(02)00226-3     Document Type: Article

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