Thermal ageing induces drastic changes on mechanical and damage behavior of Sn3.0Ag0.5Cu alloy

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1661-1665

  Dompierre, B ^a,b,c,d   Maia Filho, W C ^a   Brizoux, M ^a   Aubin, V ^b,c,d   Charkaluk, E ^b,d  

^a THALES   (France)

^b UNIV LILLE   (France)

^c LABORATOIRE DE MÉCANIQUE DE LILLE   (France)

^d CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTS; CU ALLOY; DAMAGE BEHAVIOR; DOGBONE; ELECTRONIC COMPONENT; HARDNESS TEST; HIGH TEMPERATURE; MECHANICAL BEHAVIOR; MECHANICAL STRESS; NUMBER OF CYCLES TO FAILURE; SNAGCU ALLOYS; SOLDER BALLS; SOLDER JOINT RELIABILITY; TENSILE TESTS; THERMAL AGEING; TORSION TESTS;

ALLOYS; CERIUM ALLOYS; COMPRESSION TESTING; COPPER ALLOYS; HARDNESS; HARDNESS TESTING; MECHANICAL ENGINEERING; TENSILE TESTING; TESTING; TORSION TESTING; TORSIONAL STRESS;

MECHANICAL PROPERTIES;

EID: 79953285241     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.125     Document Type: Conference Paper

References (8)

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