Influence of thermal ageing on long term reliability of SnAgCu solder joints

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Dompierre, B ^a,b   Aubin, V ^a   Charkaluk, E ^a   Filho, W C Maia ^b   Brizoux, M ^b  

^a LABORATOIRE DE MÉCANIQUE DE LILLE   (France)

^b Engineering and Process Management   (France)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE; LONG TERM; LONG-TERM MISSION; MECHANICAL BEHAVIOUR; MICRO-STRUCTURAL; SNAGCU ALLOYS; SNAGCU SOLDER; THERMAL AGEING;

BRAZING; MECHATRONICS; MICROELECTRONICS; MICROSYSTEMS; WELDING;

STRESSES;

EID: 67650524178     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938473     Document Type: Conference Paper

References (9)

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2. th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and MicroSystems -EuroSimE, Freiburg-im-Breisgau, Germany, April 2008, pp. 1-12.
3. J. Kern, C. Drewien, F. Yost, S. Sackinger, and M. Weiser, "High temperature solder alloys for underhood applications: Final report," National Science Digital Library, http://nsdl.org/, May. 2007.
4. M.A. Meyers and K.K. Chawla, Mechanical Behavior of Materials, Prentice Hall (New York, United-States, 1999)
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6. N. Hansen, "Hall-Petch relation and boundary strengthening," Scripta Materialia, vol. 51, Oct. 2004, pp. 801-806.
7. th International Conference on Thermal, Mechanical and MultiPhysics Simulation Experiments in Microelectronics and Micro-Systems, EuroSime 2007,2007, pp. 1-10.
8. M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, and T. Shibuya, "Mechanical characterization of Sn-Ag-based lead-free solders," Microelectronics Reliability, vol. 42, Juin. 2002, pp. 951-966. (Pubitemid 34551888)
9. IPC Standard, "IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments," 1992.