Torsion test applied for reballing and solder paste volume evaluation

Microelectronics Reliability

Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1663-1667

  Maia Filho, W C ^a,b   Brizoux, M ^a   Fremont H ^b   Danto, Y ^b  

^a Engineering and Process Management   (France)

^b UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; RELIABILITY ANALYSIS; SOLDERING ALLOYS; THERMAL CYCLING; TORSION TESTING;

REBALLING; SOLDER PASTE VOLUME EVALUATION; TEST DURATION;

INTERCONNECTION NETWORKS;

EID: 34548697735     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.028     Document Type: Article

References (5)

1. Maia Filho WC, Brizoux M, Frémont H, Danto Y. Solder joint loading conditions under torsion test IEEE, CPMT, Eurosime 2006, Italy; 2006.
2. Maia Filho W.C., Brizoux M., Frémont H., and Danto Y. Improved physical understanding of intermittent failure in continuous monitoring method. Microelectron Reliab 46 (2006) 1886-1891
3. Wilcox JR, Godown TC, Adams JA. A Pb-free transition strategy for servers. In: IPC soldertec global conference on lead free electronics 2005, Barcelona, Spain; 2005.
4. Maia Filho WC, Grivon A, Brizoux M. Evaluation of BGA reballing process as a solution for backward issue. In: IPC/JEDEC international conference on lead free electronic components and assemblies, Frankfurt, Germany; 2006.
5. CBGA Surface Mount Assembly and Rework, User's Guide. IBM. http://www.ibm.com May 23; 2002.