Silver flip-chip technology by solid-state bonding

Journal of Electronic Packaging

Volumn 132, Issue 3, 2010, Pages

  Wang, Pin J ^a,b   Lee, Chin C ^a  

^a University of California at Irvine   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

direct bonding; electronic packaging; flip chip; integrated circuits; silver joints; solid state bonding process

Indexed keywords

ASPECT RATIO; CHIP SCALE PACKAGES; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; LEAD-FREE SOLDERS; SILICON; SOLDERING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TIMING CIRCUITS;

BONDING PROCESS; CU SUBSTRATE; DIRECT BONDING; ELECTRONIC PACKAGING; FLIP CHIP; FLIP-CHIP JOINTS; SILICON CHIP; SILVER JOINT; SOLID STATE BONDING; SOLID-STATE BONDING PROCESS;

SUBSTRATES;

EID: 79953253596     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4002297     Document Type: Article

References (14)

1. Tummala, R. R., Rymaszewski, E. J., and Klopfenstein, A. G., 1997, Microelectronics Packaging Handbook: Semiconductor Packaging, Chapman and Hall, New York.
2. Li, M., Lee, K. Y., Olsen, D. R., Chen, W. T., Tan, B. T. C., and Mhaisalkar, S., 2002, "Microsturcture, Joint Strength and Failure Mechanisms of SnPB and Pb-Free Solders in BGA Packages," IEEE Trans. Electron. Packag. Manuf., 25, pp. 185-192.
3. Frear, D. R., Jang, J. W., Lin, J. K., and Zhang, C., 2001, "Pb-Free Solders for Flip-Chip Interconnects," JOM, 53, pp. 28-32.
4. Dang, B., Wright, S. L., Andry, P. S., Tsang, C. K., Patel, C., Polastre, R., Horton, R., Sakuma, K., Webb, B. C., Sprogis, E., Zhang, G., Sharma, A., and Knickerbocker, J. U., 2007, "Assembly, Characterization, and Reworkability of Pb-Free Ultra Fine Pitch C4s for System-on-Package," IEEE Electronic Components and Technology Conference, pp. 42-48. (Pubitemid 47577007)
5. 1990, Metals Handbook, 10th ed., ASM International, OH, Vol. 2, pp. 699 and 1113.
6. Yeung, B., and Jang, J.-W., 2002, "Correlation Between Mechanical Tensile Properties and Microstructure of Eutectic Sn-3.5Ag Solder," J. Mater. Sci. Lett., 21, pp. 723-726. (Pubitemid 34758925)
7. Lee, C. C., Wang, P. J., and Kim, J. S., 2007, "Are Intermetallics in Solder Joints Really Brittle?," IEEE Electronic Components and Technology Conference, pp. 648-652. (Pubitemid 47577099)
8. Jang, J.-W., De Silva, A. P., Drye, J. E., Post, S. L., Owens, N. L., Lin, J.-K., and Frear, D. R., 2007, "Failure Morphology After Drop Impact Test of Ball Grid Array BGA Package With Lead-Free Sn-3.8Ag-0.7Cu and Eutectic SnPb Solders," IEEE Trans. Electron. Packag. Manuf., 30, pp. 49-53. (Pubitemid 46523153)
9. Qu, S., Xu, Y., Tu, K. N., Alam, M. O., and Chan, Y. C., 2005, "Micro-Impact Test on Lead-Free BGA Balls on Au/electrolytic Ni/Cu Bond Pad," IEEE Electronic Components and Technology Conference, pp. 467-471. (Pubitemid 41276213)
10. Lee, C. C., Wang, D. T., and Choi, W. S., 2006, "Design and Construction of a Compact Vacuum Furnace for Scientific Research," Rev. Sci. Instrum., 77, p. 125104.
11. Bukaluk, A., 1990, "AES Depth Profile Studies of Interdiffusion in Thin Polycrystalline Au-Ag Multilayer Films," Appl. Surf. Sci., 45, pp. 57-64. (Pubitemid 20732806)
12. Bukaluk, A., 2001, "Auger Electron Spectroscopy Investigations of the Effect of Degradation Depth Resolution and Its Influence on the Interdiffusion Data in Thin Film Au/Ag, Cu/Ag, Pd/Au and Pd/Cu Multilayer Structures," Appl. Surf. Sci., 175-176, pp. 790-796. (Pubitemid 32427514)
13. Bukaluk, A., 1990, "AES Depth Profile Studies of Interdiffusion in the Ag-Cu Bilayer and Multilayer Thin Films," Phys. Status Solidi A, 118, pp. 99-107. (Pubitemid 20684004)
14. Pitts, J. R., Czanderna, A. W., and Thomas, T. M., 1986, "Ion Scattering Spectroscopy and Auger Electron Spectroscopy Depth Profiles of Silver- Copper Thin Film Interdiffusion," J. Vac. Sci. Technol. A, 4, pp. 1671-1674.