Multi-walled carbon nanotube/nanocrystalline copper nanocomposite film as an interconnect material

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1282-1286

  Yoo, Jung Joon ^a   Song, Jae Yong ^b   Yu, Jin ^a   Lyeo, Ho Ki ^b   Lee, Sungjun ^b   Hahn, Jun Hee ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON FIBER REINFORCED PLASTICS; CARBON FILMS; CARBON NANOTUBES; COMPUTER NETWORKS; COPPER; DOPING (ADDITIVES); ELECTRIC RESISTANCE; FILMS; MECHANICAL PROPERTIES; METHOD OF MOMENTS; MULTIWALLED CARBON NANOTUBES (MWCN); THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL INSULATING MATERIALS; THERMODYNAMIC PROPERTIES; THERMOELECTRICITY;

NANO-COMPOSITE FILMS;

NANOSTRUCTURED MATERIALS;

EID: 51349153025     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550140     Document Type: Conference Paper

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