5 nm-thick (AlCrTaTiZrRu)N0.5 multi-component barrier layer with high diffusion resistance for Cu interconnects

Nanoscience and Nanotechnology Letters

Volumn 3, Issue 2, 2011, Pages 289-293

  Chang, Shou Yi ^a   Wang, Chen Yuan ^a   Li, Chen En ^a   Huang, Yi Chung ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Diffusion Barrier; High Entropy Alloy; Interconnect

Indexed keywords

AMORPHOUS STRUCTURES; BARRIER LAYERS; CU DIFFUSION; CU FILMS; CU-INTERCONNECTS; DIFFUSION RESISTANCE; ELECTRICAL RESISTANCES; HIGH ENTROPY ALLOYS; HIGH TEMPERATURE; INTER-DIFFUSION; INTERCONNECT; METALLIC ELEMENTS; MULTICOMPONENTS; SI SUBSTRATES;

AMORPHOUS FILMS; COPPER; ENTROPY; METALLIC COMPOUNDS; SILICIDES; SILICON;

DIFFUSION BARRIERS;

EID: 79952724270     PISSN: 19414900     EISSN: 19414919     Source Type: Journal    
DOI: 10.1166/nnl.2011.1155     Document Type: Conference Paper

References (17)

1. E. Zschech, Metal Based Thin Films for Electronics, edited by K. Wetzig and C. M. Schneider, Wiley-VCH GmbH and Co. KGaA, Weinheim, Germany (2003), p. 222.
2. D. J. Kim, Y. T. Kim, and J. W. Park, J. Appl. Phys. 82, 4847 (1997).
3. T. Kouno, H. Niwa, and M. Yamada, J. Electrochem. Soc. 145, 2164 (1998).
4. S. Rawal, D. P. Norton, H. Ajmera, T. J. Anderson, and L. McElwee- White, Appl. Phys. Lett. 90, 051913 (2007).
5. Y. L. Kuo, C. Lee, J. C. Lin, Y. W. Yen, and W. H. Lee, Thin Solid Films 484, 265 (2005).
6. S. H. Kwon, O. K. Kwon, J. S. Min, and S. W. Kang, J. Electrochem. Soc. 153, G578 (2006).
7. C. W. Chen, J. S. Chen, and J. S. Jeng, J. Electrochem. Soc. 155, H438 (2008).
8. L. C. Leu, D. P. Norton, L. McElwee-White, and T. J. Anderson, Appl. Phys. Lett. 92, 111917 (2008).
9. Q. Xie, X. P. Qu, J. J. Tan, Y. L. Jiang, M. Zhou, T. Chen, and G. P. Ru, Appl. Surf. Sci. 253, 1666 (2006).
10. X. P. Qu, J. J. Tan, M. Zhou, T. Chen, Q. Xie, G. P. Ru, and B. Z. Li, Appl. Phys. Lett. 88, 151912 (2006).
11. Q. Xie, Y. L. Jiang, J. Musschoot, D. Deduytsche, C. Detavernier, R. L. Van Meirhaeghe, S. Van den Berghe, G. P. Ru, B. Z. Li, and X. P. Qu, Thin Solid Films 517, 4689 (2009).
12. J. W. Yeh, S. K. Chen, S. J. Lin, J. Y. Gan, T. S. Chin, T. T. Shun, C. H. Tsau, and S. Y. Chang, Adv. Eng. Mater. 6, 299 (2004).
13. C. J. Tong, M. R. Chen, S. K. Chen, J. W. Yeh, T. T. Shun, S. J. Lin, and S. Y. Chang, Metall. Mater. Trans. A 36A, 1263 (2005).
14. C. H. Lai, S. J. Lin, J. W. Yeh, and S. Y. Chang, Surf. Coat. Technol. 201, 3275 (2006).
15. M. H. Tsai, C. W. Wang, C. H. Lai, J. W. Yeh, and J. Y. Gan, Appl. Phys. Lett. 92, 052109 (2008).
16. S. Y. Chang, M. K. Chen, and D. S. Chen, J. Electrochem. Soc. 156, G37 (2009).
17. R. F. Zhang and S. Veprek, Thin Solid Films 516, 2264 (2010).