Improvement of optical resolution through chip backside using FIB trenches

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2010, Pages 176-180

  Glowacki, Arkadiusz ^a,b   Helfmeier, Clemens ^a,b   Kerst, Uwe ^a,b   Boit, Christian ^a,b   Perdu, Philippe ^c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b CNES ^*  (Germany)

^c CNES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SILICON; CCD DETECTORS; INTERFERENCE BANDS; OPTICAL RESOLUTION; REFLECTANCE SPECTROMETRY; REFLECTED LIGHT; SILICON MATERIALS; SPATIAL RESOLUTION; TEST STRUCTURE;

BANDPASS FILTERS; COPYING; IMAGE QUALITY; IMAGE RESOLUTION; QUALITY ASSURANCE;

FAILURE ANALYSIS;

EID: 79952355157     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Jianlei Tao, Peiyuan Fang, Jiaji Wang, "Backside IR Photon Emission Microscopy (IR-PEM) Observation in Failure Analysis of the Packaged Devices" ICEPT 2007, pages 1-4
2. R. Schlangen, R. Leihkauf, U. Kerst, C. Boit, "Functional IC Analysis Through Chip Backside With Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level" Proc. ISTFA 2006, pages 376-381
3. th ESREF (2005) 1544
4. C. Boit, U. Kerst, R. Schlangen, A. Kabakow, E. Le Roy, R. Lundquist, S. Pauthner, "Impact of Backside Circuit Edit on Active Device Performance in Bulk Silicon ICs" Proc. 37th ITC (2005) 48.2