Temperature stability improvement of thin-film thermopiles by implementation of a diffusion barrier of TiN

Proceedings of IEEE Sensors

Volumn , Issue , 2009, Pages 483-486

  Buchner, R ^a   Sosna, C ^a   Lang, W ^a  

^a UNIVERSITY OF BREMEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION PROCESS; ELEVATED TEMPERATURE; HIGH TEMPERATURE; SEMI-METALS; SYSTEM FAILURES; TEMPERATURE STABILITY; THERMOELECTRIC DEVICES;

DIFFUSION BARRIERS; ELECTRIC BATTERIES; POLYSILICON; SENSORS; TELLURIUM COMPOUNDS; TERNARY SYSTEMS; THERMOCOUPLES; THERMOPILES; TITANIUM; TITANIUM ALLOYS; TITANIUM NITRIDE; TUNGSTEN;

SYSTEM STABILITY;

EID: 77951131571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2009.5398280     Document Type: Conference Paper

References (6)

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6. Buchner, R. und Lang, W.: T, Patent, DE 10 2007 038 726, 19.02. 2009