Uniform shell patterning using rubber-assisted hot embossing process. I. Experimental

Polymer Engineering and Science

Volumn 51, Issue 3, 2011, Pages 592-600

  Nagarajan, Pratapkumar ^a   Yao, Donggang ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOLDS; POLYMER FILMS; SEMICONDUCTING FILMS;

FEATURE TRANSFERS; HARD MOLDS; HARD SURFACE; HOT EMBOSSING PROCESS; HOT-EMBOSSING; MOLD SURFACES; PROCESSING CONDITION; RUBBER PADS; THERMOPLASTIC FILMS; THICKNESS UNIFORMITY;

RUBBER;

EID: 79951741207     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.21855     Document Type: Article

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