Through-thickness embossing process for fabrication of three-dimensional thermoplastic parts

Polymer Engineering and Science

Volumn 47, Issue 12, 2007, Pages 2075-2084

  Nagarajan, Pratapkumar ^a   Yao, Donggang ^a   Ellis, Thomas S ^b   Azadegan, Reza ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ISOTHERMS; MILLIMETER WAVE DEVICES; SUBSTRATES; SURFACE STRUCTURE; THICKNESS MEASUREMENT; WAVEGUIDES;

MULTICHANNEL MILLIMETER WAVEGUIDES; POLYMER SUBSTRATES; ROOM TEMPERATURE; THROUGH-THICKNESS EMBOSSING PROCESS;

THERMOPLASTICS;

EID: 37649025185     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.20924     Document Type: Article

References (10)

1. M. Heckele and W.K. Schomburg, J. Micromech. Microeng., 14, R1 (2004).
2. H. Becker and C. Gartner, Electrophoresis, 21, 12 (2000).
3. M. Heckele and A. Durand, in The Proceedings of 2001 Euspen's 2nd International Conference, Torino, Italy, May 27-31, 196-198 (2001).
4. M. Werner, "Hot Embossing of Through-Holes in Cyclo-Olefin Copolymer," Diploma Thesis, Technical University of Denmark, Denmark, 2005.
5. A.D. Mazzeo, M. Dirckx, and D.E. Hardt, SPE ANTEC Technical Papers, Cincinnati, May 6-10, 2977-2981 (2007).
6. J. Kraus and D. Fleisch, Electromagnetics with Applications, McGraw-Hill, New York, 456-468 (1999).
7. F. Sammoura, Y.-C. Su, Y. Cai, C.-Y. Chi, B. Elamaran, L. Lin, and L.-C. Chiao, Sensor Actuator A, 129, 270 (2006).
8. D. Yao, V.L. Virupaksha, and B. Kim, Polym. Eng. Sci., 45, 652 (2005).
9. Y.-J. Juang, L.J. Lee, and K.W. Koelling, Polym. Eng. Sci., 42, 551 (2002).
10. D. Yao, P. Nagarajan, L. Li, and A.Y. Yi, Polym. Eng. Sci., 47, 530 (2007).