Decomposition of trichloroethylene with plasma-catalysis: A review

Journal of Advanced Oxidation Technologies

Volumn 14, Issue 1, 2011, Pages 165-173

  Vandenbroucke, A M ^a   Morent, R ^a   De Geyter, N ^a   Leys, C ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

AIR CLEANERS; ANESTHETICS; ATMOSPHERIC PRESSURE; CATALYSIS; DIELECTRIC MATERIALS; ELECTRIC CORONA; GLOW DISCHARGES; HYBRID SYSTEMS; INDUSTRIAL RESEARCH; TRICHLOROETHYLENE; VOLATILE ORGANIC COMPOUNDS; WASTE TREATMENT;

ATMOSPHERIC PRESSURE GLOW DISCHARGE; DIELECTRIC BARRIER DISCHARGES; INDUSTRIAL SOLVENTS; LITERATURE OVERVIEW; NON-THERMAL PLASMA TREATMENT; NONTHERMAL PLASMA; PULSED CORONA DISCHARGES; PURIFICATION TECHNIQUES;

PLASMA APPLICATIONS;

EID: 79751511961     PISSN: 12038407     EISSN: None     Source Type: Journal    
DOI: 10.1515/jaots-2011-0120     Document Type: Article

References (97)

1. Tollefsen, P.; Rypdal, K.; Torvanger, A.; Rive, N. Environ. Sci. Policy. 2009, 12(7), 870-881.
2. Atkinson, R. Atmos. Environ. 2000, 34(12-14), 2063-2101.
3. Sudnick, J. J.; Corwin, D. L. Hazard. Waste Hazard. Mater. 1994, 11(1), 129-143.
4. Kim, H. H. Plasma Process.Polym. 2004, (2), 91-110.
5. Park, D. W.; Yoon, S. H.; Kim, G. J.; Sekiguchi, H. J. Ind. Eng. Chem. 2002, 8(4), 393-398.
6. Magureanu, M.; Mandache, N. B.; Parvulescu, V. I. Plasma Chem. Plasma Process. 2007, 27(6), 679-690.
7. Ma, H. B.; Chen, P.; Zhang, M. L.; Lin, X. Y.; Ruan, R. Plasma Chem. Plasma Process. 2002, 22(2), 239-254.
8. Guo, Y. F.; Ye, D. Q.; Chen, K. F.; He, J. C.; Chen, W. L. J. Mol. Catal. A-Chem. 2006, 245(1-2), 93-100.
9. Oda, T.; Takahashi, T.; Tada, K. IEEE Trans. Ind. Appl. 1999, 35(2), 373-379.
10. Oda, T.; Takahashi, T.; Kohzuma, S. IEEE Trans. Ind. Appl. 2001, 37(4), 965-970.
11. Oda, T. J. Electrostat. 2003, 57(3-4), 293-311.
12. Francke, K. P.; Miessner, H.; Rudolph, R. Plasma Chem. Plasma Process. 2000, 20(3), 393-403.
13. Futamura, S.; Yamamoto, T. IEEE Trans. Ind. Appl. 1997, 33(2), 447-453.
14. Hsiao, M.; Merritt, B. T.; Penetrante, B. M.; Vogtlin, G. E.; Wallman, P. H. J. Appl. Phys. 1995, 78(5), 3451-3456.
15. Kirkpatrick, M. J.; Finney, W. C.; Locke, B. R. Plasmas Polym. 2003, 8(3), 165-177.
16. Yamamoto, T.; Futamura, S. Combust. Sci. Technol. 1998, 133(1-3), 117-133.
17. Takaki, K.; Urashima, K.; Chang, J. S. IEEE Trans. Plasma Sci. 2004, 32(6), 2175-2183.
18. Ogata, A.; Shintani, N.; Mizuno, K.; Kushiyama, S.; Yamamoto, T. IEEE Trans. Ind. Appl. 1999, 35(4), 753-759.
19. Roland, U.; Holzer, F.; Kopinke, F. D. Catal. Today. 2002, 73(3-4), 315-323.
20. Machala, Z.; Morvova, M.; Marode, E.; Morva, I. J. Phys. D-Appl. Phys. 2000, 33(24), 3198-3213.
21. Blin-Simiand, N.; Tardiveau, P.; Risacher, A.; Jorand, F.; Pasquiers, S. Plasma Process. Polym. 2005, 2(3), 256-262.
22. Chang, C. L.; Lin, T. S. Plasma Chem. Plasma Process. 2005, 25(3), 227-243.
23. Ding, H. X.; Zhu, A. M.; Lu, F. G.; Xu, Y.; Zhang, J.; Yang, X. F. J. Phys. D-Appl. Phys. 2006, 39(16), 3603-3608.
24. Storch, D. G.; Kushner, M. J. J. Appl. Phys. 1993, 73(1), 51-55.
25. Lee, H. M.; Chang, M. B. Plasma Chem. Plasma Process. 2001, 21(3), 329-343.
26. Paterkowski, W.; Parus, W.; Kalisiak, S. Pol. J. Chem. Technol. 2009, 11(4), 57-62.
27. Taranto, R.; Frochot, D.; Pichat, P. Ind. Eng. Chem. Res. 2007, 46(23), 7611-7614.
28. Subrahmanyarn, C.; Renken, A.; Kiwi-Minsker, L. Plasma Chem. Plasma Process. 2007, 27(1), 13-22.
29. Snyder, H. R.; Anderson, S. K. IEEE Trans. Plasma Sci. 1998, 26(6), 1695-1699.
30. Anderson, G. K.; Snyder, H.; Coogan, J. Plasma Chem. Plasma Process. 1999, 19(1), 131-151.
31. Lee, H. M.; Chang, M. B. Plasma Chem. Plasma Process. 2003, 23(3), 541-558.
32. Satoh, K.; Matsuzawa, T.; Itoh, H. Thin Solid Films. 2008, 516(13), 4423-4429.
33. Li, D. A.; Yakushiji, D.; Kanazawa, S.; Ohkubo, T.; Nomoto, Y. J. Electrostat. 2002, 55(3-4), 311-319.
34. Yamamoto, T.; Mizuno, K.; Tamori, I.; Ogata, A.; Nifuku, M.; Michalska, M.; Prieto, G. IEEE Trans. Ind. Appl. 1996, 32(1), 100-105.
35. Futamura, S.; Zhang, A. H.; Prieto, G.; Yamamoto, T. IEEE Trans. Ind. Appl. 1998, 34(5), 967-974.
36. Smulders, E. H. W. M.; van Heesch, B. E. J. M.; van Paasen, S. S. V. B. IEEE Trans. Plasma Sci. 1998, 26(5), 1476-1484.
37. Agnihotri, S.; Cal, M. P.; Prien, J. J. Environ. Eng.- ASCE 2004, 130(3), 349-355.
38. Wallis, A. E.; Whitehead, J. C.; Zhang, K. Appl. Catal. B: Environ. 2007, 72(3-4), 282-288.
39. Chavadej, S.; Saktrakool, K.; Rangsunvigit, P.; Lobban, L. L.; Sreethawong, T. Chem. Eng. J. 2007, 132(1-3), 345-353.
40. Magureanu, M.; Mandache, N. B.; Parvulescu, V. I. Plasma Chem. Plasma Process. 2007, 27(6), 679-690.
41. Thevenet, F.; Guaitella, O.; Puzenat, E.; Guillard, C.; Rousseau, A. Appl. Catal. B: Environ. 2008, 84(3-4), 813-820.
42. Mok, Y. S.; Lee, S. B.; Oh, J. H.; Ra, K. S.; Sung, B. H. Plasma Chem. Plasma Process. 2008, 28(6), 663-676.
43. Blackbeard, T.; Demidyuk, V.; Hill, S. L.; Whitehead, J. C. Plasma Chem. Plasma Process. 2009, 29(6), 411-419.
44. Malik, M. A.; Minamitani, Y.; Schoenbach, K. H. IEEE Trans. Plasma Sci. 2005, 33(1), 50-56.
45. Kim, Y.; Kim, K. T.; Cha, M. S.; Song, Y. H.; Kim, S. J. IEEE Trans. Plasma Sci. 2005, 33(3), 1041-1046.
46. Futamura, S.; Gurusamy, A. J. Electrostat. 2005, 63(6-10), 949-954.
47. Chang, M. B.; Lee, H. M. Catal. Today. 2004, 89(1- 2), 109-115.
48. Yu, S. J.; Chang, M. B. Plasma Chem. Plasma Process. 2001, 21(3), 311-327.
49. Sugasawa, M.; Annadurai, G.; Futamura, S. IEEE Trans. Ind. Appl. 2009, 45(4), 1499-1505.
50. Zhu, T.; Li, J.; Liang, W. J.; Jin, Y. Q. J. Hazard. Mater. 2009, 165(1-3), 1258-1260.
51. Oh, S. M.; Kim, H. H.; Einaga, H.; Ogata, A.; Futamura, S.; Park, D. W. Thin Solid Films. 2006, 506 418-422.
52. Holzer, F.; Kopinke, F. D.; Roland, U. Plasma Chem. Plasma Process. 2005, 25(6), 595-611.
53. Futamura, S.; Einaga, H.; Kabashima, H.; Hwan, L. Y. Catal. Today. 2004, 89(1-2), 89-95.
54. Demidiouk, V.; Chae, J. O. IEEE Trans. Plasma Sci. 2005, 33(1), 157-161.
55. Eliasson, B.; Hirth, M.; Kogelschatz, U. J. Phys. DAppl. Phys. 1987, 20(11), 1421-1437.
56. McAdams, R. J. Phys. D-Appl. Phys. 2001, 34(18), 2810-2821.
57. Jarrige, J.; Vervisch, P. J. Appl. Phys. 2006, 99 (11).
58. Smulders, E. H. W. M.; van Heesch, B. E. J. M.; van Paasen, S. S. V. B. IEEE Trans. Plasma Sci. 1998, 26(5), 1476-1484.
59. Nifuku, M.; Horvath, M.; Bodnar, J.; Zhang, G. Y.; Tanaka, T.; Kiss, E.; Woynarovich, G.; Katoh, H. J. Electrostat. 1997, 40-1 687-692.
60. Shang, K. F.; Wu, Y.; Li, J.; Li, G. F.; Li, D.; Wang, N. H. Plasma Chem. Plasma Process. 2006, 26(5), 443-454.
61. Shi, Y.; Ruan, J.; Wang, X.; Ll, W.; Tan, T. Environ. Sci. Technol. 2005, 39(17), 6786-6791.
62. Leys, C. Contrib. Plasma Phys. 2004, 44(5-6), 542-545.
63. Kunhardt, E. E. IEEE Trans. Plasma Sci. 2000, 28(1), 189-200.
64. Callebaut, T.; Kochetov, I.; Akishev, Y.; Napartovich, A.; Leys, C. Plasma Sources Sci. Technol. 2004, 13(2), 245-250.
65. Akishev, Y.; Goossens, O.; Callebaut, T.; Leys, C.; Napartovich, A.; Trushkin, N. J. Phys. D-Appl. Phys. 2001, 34(18), 2875-2882.
66. Akishev, Y. S.; Grushin, M. E.; Kochetov, I. V.; Napartovich, A. P.; Pan'kin, M. V.; Trushkin, N. I. Plasma Phys. Rep. 2000, 26(2), 157-163.
67. Akishev, Y. S.; Deryugin, A. A.; Karalnik, V. B.; Kochetov, I. V.; Napartovich, A. P.; Trushkin, N. I. Plasma Phys. Rep. 1994, 20(6), 511-524.
68. Vandenbroucke, A.; Morent, R.; De Geyter, N.; Nguyen Dinh, M. T.; Giraudon, J. M.; Lamonier, J. F.; Leys, C. Int. J. Plasma Environ. Sci.Technol. 2010, (in press) .
69. Vertriest, R.; Morent, R.; Dewulf, J.; Leys, C.; Van Langenhove, H. Plasma Sources Sci. Technol. 2003, 12(3), 412-416.
70. Kim, H. H.; Ogata, A.; Futamura, S. IEEE Trans. Plasma Sci. 2006, 34(3), 984-995.
71. Roland, U.; Holzer, F.; Kopinke, E. D. Appl. Catal. B: Environ. 2005, 58(3-4), 217-226.
72. Wallis, A. E.; Whitehead, J. C.; Zhang, K. Appl. Catal. B: Environ. 2007, 74(1-2), 111-116.
73. Wallis, A. E.; Whitehead, J. C.; Zhang, K. Catal. Lett. 2007, 113(1-2), 29-33.
74. Morent, R.; Leys, C.; Dewulf, J.; Neirynck, D.; Van Durme, J.; Van Langenhove, H. J. Adv. Oxid. Technol. 2007, 10(1), 127-136.
75. Morent, R.; Dewulf, J.; Steenhaut, N.; Leys, C.; Van Langenhove, H. J. Adv. Oxid. Technol. 2006, 9(1), 53-58.
76. Zhu, T.; Li, J.; Jin, Y. Q.; Liang, Y. H.; Ma, G. D. Int. J. Environ. Sci. and Technol. 2009, 6(1), 141-148.
77. Subrahmanyam, C.; Magureanu, M.; Laub, D.; Renken, A.; Kiwi-Minsker, L. J. Phys. Chem. C 2007, 111(11), 4315-4318.
78. Van Durme, J.; Dewulf, J.; Leys, C.; Van Langenhove, H. Appl. Catal. B: Environ. 2008, 78(3- 4), 324-333.
79. Oda, T.; Takahashi, T.; Kohzuma, S. IEEE Trans. Ind. Appl. 2001, 37(4), 965-970.
80. Oda, T.; Takahahshi, T.; Yamaji, K. IEEE Trans. Ind. Appl. 2002, 38(3), 873-878.
81. Oda, T.; Yamaji, K.; Takahashi, T. IEEE Trans. Ind. Appl. 2004, 40(2), 430-436
82. Oda, T.; Takahashi, T.; Yamaji, K. Conf. Rec. 2002 IEEE Ind. Appl. Conference,Vols 1-4. 2002, 1822-1828.
83. Han, S. B.; Oda, T.; Ono, R. IEEE Trans. Ind. Appl. 2005, 41(5), 1343-1349.
84. Han, S. B.; Oda, T. Plasma Sources Sci. Technol. 2007, 16(2), 413-421.
85. Magureanu, M.; Mandache, N. B.; Parvulescu, V. I.; Subrahmanyam, C.; Renken, A.; Kiwi-Minsker, L. Appl. Catal. B: Environ. 2007, 74(3-4), 270-277.
86. Subrahmanyam, C.; Magureanu, M.; Laub, D.; Renken, A.; Kiwi-Minsker, L. J. Phys. Chem. C 2007, 111(11), 4315-4318.
87. Magureanu, M.; Mandache, N. B.; Hu, J. C.; Richards, R.; Florea, M.; Parvulescu, V. I. Appl. Catal. B: Environ. 2007, 76(3-4), 275-281.
88. Fan, A. M. Rev. Environ. Contam. Toxicol. 1988, 101 55-92.
89. Oda, T.; Takahahshi, T.; Yamaji, K. IEEE Trans. Ind. Appl. 2002, 35(2), 373-378.
90. Oda, T.; Takahashi, T.; Yamaji, K. Conf. Rec. 2002 IEEE Ind. Appl. Conf., Vols 1-4. 2002, 1822-1828.
91. Oda, T.; Yamaji, K.; Takahashi, T. IEEE Trans. Ind. Appl. 2004, 40(2), 430-436.
92. Han, S. B.; Oda, T.; Ono, R. IEEE Trans. Ind. Appl. 2005, 41(5), 1343-1349.
93. Morent, R.; Dewulf, J.; Steenhaut, N.; Leys, C.; Van Langenhove, H. J. Adv. Oxid. Technol. 2006, 9(1), 53-58.
94. Magureanu, M.; Mandache, N. B.; Parvulescu, V. I.; Subrahmanyam, C.; Renken, A.; Kiwi-Minsker, L. Appl. Catal. B: Environ. 2007, 74(3-4), 270-277.
95. Han, S. B.; Oda, T. Plasma Sources Sci. Technol. 2007, 16(2), 413-421.
96. Subrahmanyam, C.; Renken, A.; Kiwi-Minsker, L. Chem. Eng. J. 2007, 134(1-3), 78-83.
97. Magureanu, M.; Mandache, N. B.; Hu, J. C.; Richards, R.; Florea, M.; Parvulescu, V. I. Appl. Catal. B: Environ. 2007, 76(3-4), 275-281.