Correlation of mechanical and chemical cure development for phenol-formaldehyde resin bonded wood joints

Thermochimica Acta

Volumn 513, Issue 1-2, 2011, Pages 20-25

  Wang, Jinwu ^a   Laborie, Marie Pierre G ^b   Wolcott, Michael P ^c  

^a MISSISSIPPI STATE UNIVERSITY   (United States)

^b UNIVERSITY OF FREIBURG   (Germany)

^c Washington State University   (United States)

Author keywords

Chemical degree of cure; Dynamical mechanical analysis; Kinetic models; Mechanical degree of cure; Phenol formaldehyde resins

Indexed keywords

DEGREE OF CURE; DYNAMICAL MECHANICAL ANALYSIS; KINETIC MODELS; MECHANICAL DEGREES; PHENOL-FORMALDEHYDE RESINS;

ALGORITHMS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DISTRIBUTION FUNCTIONS; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; FORMALDEHYDE; HEATING; HOT PRESSING; KINETIC THEORY; PHENOLIC RESINS; PHENOLS; RATING; REACTION KINETICS; SYNTHETIC RESINS; WEIBULL DISTRIBUTION; WOODEN CONSTRUCTION;

CHEMICAL ANALYSIS;

EID: 78751646879     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2010.11.001     Document Type: Article

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