Kinetic analysis of phenol-formaldehyde bonded wood joints with dynamical mechanical analysis

Thermochimica Acta

Volumn 491, Issue 1-2, 2009, Pages 58-62

  Wang, Jinwu ^a   Laborie, Marie Pierre G ^b   Wolcott, Michael P ^b  

^a WEYERHAEUSER COMPANY   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Dynamical mechanical analysis (DMA); Gelation; Kinetic models; Phenol formaldehyde resins; Vitrification; Wood

Indexed keywords

ADHERENDS; ADHESIVE LAYERS; ADHESIVE SYSTEMS; COMMON MODELS; CURING PROCESS; DYNAMICAL MECHANICAL ANALYSIS; DYNAMICAL MECHANICAL ANALYSIS (DMA); IN-SITU; KINETIC ANALYSIS; KINETIC MODELS; LINEAR HEATING; MECHANICAL DEVELOPMENT; MODEL FITTING; MOISTURE LOSS; PHENOL-FORMALDEHYDE; PHENOL-FORMALDEHYDE RESINS; PROCESS OPTIMIZATION; STORAGE MODULI; THREE-POINT BENDING TEST; WOOD JOINTS; WOOD-BASED PANELS;

ALUMINA; ALUMINUM FOIL; BENDING TESTS; COAGULATION; CURING; DIAMOND CUTTING TOOLS; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; FORMALDEHYDE; GELATION; HOT PRESSING; KINETIC THEORY; PHENOLS; RESINS; VITRIFICATION; WOOD; WOODEN CONSTRUCTION;

PHENOLIC RESINS;

ALUMINUM; CURING; DIAMOND; FORMALDEHYDE; GELATION; HOT PRESSING; KINETICS; OPTIMIZATION; PHENOL; WOOD;

EID: 67449126859     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2009.03.001     Document Type: Article

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