Dynamic thermomechanical analysis as a control technique for thermoset bonding of wood joints

International Journal of Adhesion and Adhesives

Volumn 18, Issue 2, 1998, Pages 89-94

  Onic, L ^a   Bucur, V ^b   Ansell, M P ^c   Pizzi, A ^a   Deglise, X ^a   Merlin, A ^a  

^a UNIVERSITÉ DE LORRAINE   (France)

^b CEMAGREF   (France)

^c UNIVERSITY OF BATH   (United Kingdom)

Author keywords

A. adhesives for wood; B. wood; C. non destructive testing

Indexed keywords

EID: 0005904596     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0143-7496(97)00049-3     Document Type: Article

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