Spherical polymer particles in isotropic conductive adhesives a study on rheology and mechanical aspects

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Nguyen, Hoang Vu ^a   Kristiansen, Helge ^b   Gakkestad, Jakob ^c   Johannessen, Rolf ^d   Hoivik, Nils ^a   Aasmundtveit, Knut E ^a  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

^b Mosaic Solutions AS and Conpart AS   (Norway)

^c NORWEGIAN DEFENCE RESEARCH ESTABLISHMENT FFI   (Norway)

^d Ge Vingmed Ultrasound AS   (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION STRENGTHS; ADHESIVE MATRICES; DIFFERENT SIZES; ISOTROPIC CONDUCTIVE ADHESIVES; MECHANICAL ASPECTS; MECHANICAL SHEAR; METAL-COATED POLYMERS; MODEL SYSTEM; PRACTICAL USE; RHEOLOGICAL PROPERTY; SOLDER JOINTS; SPHERICAL POLYMERS;

ADHESIVES; FILLED POLYMERS; INDEPENDENT COMPONENT ANALYSIS; POLYMERS; RHEOLOGY; SHEAR STRENGTH; SPHERES; VISCOSITY;

MECHANICAL PROPERTIES;

EID: 78651276997     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5643022     Document Type: Conference Paper

References (19)

1. J. H. Lau, C. P. Wong, N. C. Lee, and S. W. R. Lee, "Chapter 17. Introduction to Conductive Adhesives," in Electronics Manufacturing with Lead-free, Halogen-free and Conductive Adhesive Materials New York: McGraw-Hill, 2002.
2. H. Kristiansen, M. M. V. Taklo, T. Bakke, J. Gakkestad, P. Dalsjo, R. Johannessen, F. Oldervoll, and H.-V. Nguyen, "Development of Low Modulus Conductive Adhesives for MEMS Interconnects," in Pan Pacific Microelectronics Symposium, Hawaii, United States, 2009, pp. 306-310.
3. J. Gakkestad, P. Dalsjo, H. Kristiansen, R. Johannessen, and M. M. V. Taklo, "Use of Conductive Adhesive for MEMS Interconnection in Military Fuze Applications," in SPIE Photonics West, San Francisco, California United States, 2010, pp. 7592-17.
4. M. Mundlein and J. Nicolics, "Modeling of Particle Arrangement in an Isotropically Conductive Adhesive Joint," IEEE Transactions on Components And Packaging Technologies, vol. 28, no. 4, pp. 765-770, 2005.
5. http://www.epotek.com/, "EPO-TEK® 353ND Technical Data Sheet," Apr. 2010 ed: Epoxy Technology, Inc., 2010.
6. http://www.epotek.com/, "EPO-TEK® H20E Technical Data Sheet," Feb. 2010 ed: Epoxy Technology, Inc., 2010.
7. nd ed. Hannover, Germany: Vincentz Network GmbH & Co. KG, 2006.
8. th ed: John Wiley & Sons, Inc., 2001, pp. 31-37.
9. J. J. Stickel and R. L. Powell, "Fluid Mechanics and Rheology of Dense Suspensions," Annual Review of Fluid Mechanics, vol. 37, pp. 129-149, 2005.
10. J. S. Chong, E. B. Christiansen, and A. D. Baer, "Rheology of Concentrated Suspensions," Journal of Applied Polymer Science, vol. 15, pp. 2007-2021, 1971.
11. F. Ferrini, D. Ercolani, B. d. Cindio, L. Nicodemo, L. Nicolais, and S. Ranaudo, "Shear Viscosity of Settling Suspensions," Rheologica Acta, vol. 18, no. 2, pp. 289-296, 1979.
12. V. H. Eilers, "Die Viskosität von Emulsionen hochviskoser Stoffe als Funktion der Konzentration," Colloid & Polymer Science, vol. 97, no. 3, pp. 313-321, 1941.
13. I. M. Krieger and T. J. Dougherty, "A Mechanism for Non-Newtonian Flow in Suspensions of Rigid Spheres," Journal of Rheology, vol. 3, pp. 137-152, 1959.
14. A. Einstein, "A New Determination of The Molecular Dimensions," Annalen der Physik, vol. 19, no. 2, pp. 289-306, 1906.
15. S. K. Kang, "Development of Lead (Pb)-free Interconnection Materials for Microelectronics," Metals and Materials International, vol. 5, no. 6, pp. 545-549, 1999.
16. T. Siewert, S. Liu, D. R. Smith, and J. C. Madeni, "Properties of Lead-Free Solders," February 11, 2002 ed: National Institute of Standards & Technology and Colorado School of Mines, 2002.
17. Y. Tian, C. Wang, S. Yang, P. Lin, and L. Liang, "Shear Fracture Behavior of Sn3.0Ag0.5Cu Solder joints on Cu Pads with Different Solder Volumes," in International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) Shanghai, China, 2008, pp. 1-4.
18. th Electronics Packaging Technology Conference Singapore, 2009, pp. 283-291.
19. Y. Li and C. P. Wong, "Recent Advances of Conductive Adhesives as a Lead-free Alternative in Electronic Packaging: Materials, Processing, Reliability and Applications," Materials Science and Engineering R, vol. 51, pp. 1-35, 2006.