Use of conductive adhesive for MEMS interconnection in military fuze applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7592, Issue , 2010, Pages

  Gakkestad, Jakob ^a   Dalsjo, Per ^a   Kristiansen, Helge ^b   Johannessen, Rolf ^c   Taklo, Maaike M Visser ^c  

^a NORWEGIAN DEFENCE RESEARCH ESTABLISHMENT FFI   (Norway)

^b Mosaic Solutions AS and Conpart AS   (Norway)

^c SINTEF ICT   (Norway)

Author keywords

Conductive adhesive; Fuze; MEMS; Packaging; Polymer spheres; Reliability

Indexed keywords

CENTRIPETAL ACCELERATION; CONDUCTIVE ADHESIVE; FIRING TESTS; MECHANICAL AND THERMAL PROPERTIES; MEDIUM-CALIBER AMMUNITIONS; MEMS PACKAGING; MILITARY FUZE; PAD SIZES; POLYMER SPHERES; RAPID TEMPERATURE; TEMPERATURE CYCLES; TEST CONDITION; TEST STRUCTURE;

MECHANICAL PROPERTIES; MILITARY APPLICATIONS; NANOSTRUCTURED MATERIALS; PACKAGING; POLYCHLORINATED BIPHENYLS; RELIABILITY; THERMODYNAMIC PROPERTIES;

TESTING;

EID: 77951537380     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.840890     Document Type: Conference Paper

References (7)

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