Modeling of particle arrangement in an isotropically conductive adhesive joint

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 765-770

  Mündlein, Martin ^a   Nicolics, Johann ^a  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Contact resistance; Isotropically conductive adhesive (ICA); Particle arrangement; Simulation

Indexed keywords

BINDERS; COMPOSITE MATERIALS; COMPUTER SIMULATION; CONDUCTIVE PLASTICS; ELECTRIC CONDUCTORS; ELECTRIC CONTACTS; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; ENVIRONMENTAL IMPACT; FILLERS; MATHEMATICAL MODELS; PERCOLATION (SOLID STATE);

CONDUCTIVE FILLER PARTICLES; CONTACT RESISTANCE; ISOTROPICALLY CONDUCTIVE ADHESIVE JOINT; NONCONDUCTIVE POLYMER BINDER; PARTICLE ARRANGEMENT;

ADHESIVE JOINTS;

EID: 29244463553     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859671     Document Type: Article

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