Adhesion and cyclic stretching of Au thin film on poly(dimethyl-siloxane) for stretchable electronics

Journal of Applied Physics

Volumn 108, Issue 12, 2010, Pages

  Akogwu, Onobu ^a   Kwabi, David ^a   Munhutu, Auxillia ^a   Tong, Tiffany ^a   Soboyejo, W O ^a  

^a Princeton University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AU THIN FILMS; CRACKING MECHANISMS; CYCLIC STRETCHING; EXPERIMENTAL STUDIES; NANO SCALE; POLYDIMETHYLSILOXANE PDMS; STRETCHABLE ELECTRONICS;

ADHESION; ELECTRONIC STRUCTURE; GOLD COATINGS; THIN FILMS;

GOLD;

EID: 78650924036     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3510488     Document Type: Article

References (23)

1. E. Bonderover and S. Wagner, IEEE Electron Device Lett. 0741-3106 25, 295 (2004). 10.1109/LED.2004.826537
2. V. J. Lumelky, M. S. Shur, and S. Wagner, IEEE Sens. J. 1530-437X 1, 41 (2001). 10.1109/JSEN.2001.923586
3. S. R. Forrest, Nature (London) 0028-0836 428, 911 (2004). 10.1038/nature02498 (Pubitemid 38568095)
4. J. A. Rogers, Z. Bao, K. Baldwin, A. Dodabalapur, H. Katz, K. Amundon, J. Ewing, and P. Drzaic, Proc. Natl. Acad. Sci. U.S.A. 0027-8424 98, 4835 (2001). 10.1073/pnas.091588098 (Pubitemid 32401113)
5. A. Nathan and B. R. Chalamala, Proc. IEEE 0018-9219 93, 1235 (2005). 10.1109/JPROC.2005.851525 (Pubitemid 41084570)
6. D. W. Pashley, Proc. R. Soc. London, Ser. A 0950-1207 255, 218 (1960). 10.1098/rspa.1960.0064
7. H. Huang and F. Spaepen, Acta Mater. 1359-6454 48, 3261 (2000). 10.1016/S1359-6454(00)00128-2
8. Y. Xiang, X. Chen, and J. J. Vlassak, Thin Films: Stresses and Mechanical Properties IX, MRS Symposia Proceedings No. 695 (Materials Research Society, Pittsburgh, 2002), p. 189.
9. H. D. Espinosa, B. C. Prorok, and B. Peng, J. Mech. Phys. Solids 0022-5096 52, 667 (2004). 10.1016/j.jmps.2003.07.001
10. S. Chiu, J. Leu, and P. S. Ho, J. Appl. Phys. 0021-8979 76, 5136 (1994). 10.1063/1.357227
11. B. E. Alaca, M. T. A. Saif, and H. Sehitoglu, Acta Mater. 1359-6454 50, 1197 (2002). 10.1016/S1359-6454(01)00421-9 (Pubitemid 34181953)
12. Y. Xiang and J. J. Vlassak, Scr. Mater. 1359-6462 53, 177 (2005). 10.1016/j.scriptamat.2005.03.048 (Pubitemid 40612663)
13. P. Gruber, J. Bohm, L. Sauter, R. Spolenak, and E. Artz, Nanoscale Materials and Modeling-Relations Among Processing, Microstructure and Mechanical Properties, MRS Symposia Proceedings No. 821 (Materials Research Society, Pittsburgh, 2004).
14. T. Li, Z. Y. Huang, S. P. Lacour, S. Wagner, and Z. Suo, Mech. Mater. 0167-6636 37, 261 (2005). 10.1016/j.mechmat.2004.02.002
15. T. Li, Z. Y. Huan, Z. Suo, S. P. Lacour, and S. Wagner, Appl. Phys. Lett. 0003-6951 85, 3435 (2004). 10.1063/1.1806275
16. Y. Xiang, T. Li, Z. Suo, and J. J. Vlassak, Appl. Phys. Lett. 0003-6951 87, 161910 (2005). 10.1063/1.2108110 (Pubitemid 41717052)
17. In Rev, AO; Vol. AN 90 Veeco Instruments Inc., 2005.
18. T. Tong, B. Babatope, O. Akogwu, W. Akande, and W. O. Soboyejo, J. Appl. Phys. 0021-8979 106, 083708 (2009). 10.1063/1.3246786
19. N. Bowden, S. Brittain, A. G. Evans, J. W. Hutchinson, and G. M. Whitesides, Nature (London) 0028-0836 393, 146 (1998). 10.1038/30193 (Pubitemid 28242249)
20. J. Kim and H. H. Lee, J. Polym. Sci., Part B: Polym. Phys. 0887-6266 39, 1122 (2001). 10.1002/polb.1088 (Pubitemid 32508430)
21. J. W. Hutchinson and Z. Suo, Adv. Appl. Mech. 0065-2156 29, 63 (1991). 10.1016/S0065-2156(08)70164-9
22. N. Rahbar, A. Orana, K. Wolf, C. Marynhoff, and W. O. Soboyejo, J. Appl. Phys. 0021-8979 104, 103533 (2008). 10.1063/1.3021350
23. Z. Zong, Y. Cao, N. Rahbar, and W. O. Soboyejo, J. Appl. Phys. 0021-8979 100, 104313 (2006). 10.1063/1.2388688 (Pubitemid 44853720)