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Volumn 104, Issue 10, 2008, Pages

Adhesion and interfacial fracture toughness between hard and soft materials

(9) Rahbar, Nima a Wolf, Kurt b Orana, Argjenta b Fennimore, Roy b Zong, Zong c Meng, Juan c Papandreou, George b Maryanoff, Cynthia b Soboyejo, Wole c

a University of Massachusetts Dartmouth (United States)

b JOHNSON AND JOHNSON (United States)

c Princeton University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTRONIC MEDICAL EQUIPMENT; FORECASTING; FRACTURE; FRACTURE ENERGY; FRACTURE MECHANICS; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS; STAINLESS STEEL; STRENGTH OF MATERIALS;

316L STAINLESS STEELS; DISK SPECIMENS; DRUG-ELUTING STENTS; INTERFACIAL FRACTURE ENERGIES; INTERFACIAL FRACTURES; MEDICAL DEVICES; PARYLENE; SEMICONDUCTOR APPLICATIONS; SOFT LAYERS; SOFT MATERIALS;

FRACTURE TOUGHNESS;

EID: 57049142620 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3021350 Document Type: Article

Times cited : (30)

References (17)

1
- 33845225607
- 0021-8979 10.1063/1.2388688.
- Z. Zong, Y. Cao, N. Rahbar, and W. O. Soboyejo, J. Appl. Phys. 0021-8979 10.1063/1.2388688 100, 104313 (2006).
- (2006) J. Appl. Phys. , vol.100 , pp. 104313
- Zong, Z.¹ Cao, Y.² Rahbar, N.³ Soboyejo, W.O.⁴

2
- 20544453811
- 0021-8979 10.1063/1.1900285.
- C. Kim, Y. Cao, W. O. Soboyejo, and S. R. Forrest, J. Appl. Phys. 0021-8979 10.1063/1.1900285 97, 113512 (2005).
- (2005) J. Appl. Phys. , vol.97 , pp. 113512
- Kim, C.¹ Cao, Y.² Soboyejo, W.O.³ Forrest, S.R.⁴

3
- 1242285588
- 0379-6779 10.1016/S0379-6779(03)00380-1.
- L. Ke, R. S. Kumar, K. Zhang, S. J. Chua, and A. T. S. Wee, Synth. Met. 0379-6779 10.1016/S0379-6779(03)00380-1 140, 295 (2004).
- (2004) Synth. Met. , vol.140 , pp. 295
- Ke, L.¹ Kumar, R.S.² Zhang, K.³ Chua, S.J.⁴ Wee, A.T.S.⁵

4
- 1442309128
- 0026-2692
- L. Ke, R. S. Kumar, K. Zhang, S. J. Chua, and A. T. S. Wee, Microelectron. J. 35, 325 (2004). 0026-2692
- (2004) Microelectron. J. , vol.35 , pp. 325
- Ke, L.¹ Kumar, R.S.² Zhang, K.³ Chua, S.J.⁴ Wee, A.T.S.⁵

5
- 33747031192
- 0040-6090 10.1016/j.tsf.2006.01.015.
- Y. S. Yoon, H. Y. Park, Y. C. Lim, K. G. Choi, K. C. Lee, G. B. Park, C. J. Lee, D. G. Moon, G. I. Han, Y. I. Kim, and S. C. Nam, Thin Solid Films 0040-6090 10.1016/j.tsf.2006.01.015 513, 258 (2006).
- (2006) Thin Solid Films , vol.513 , pp. 258
- Yoon, Y.S.¹ Park, H.Y.² Lim, Y.C.³ Choi, K.G.⁴ Lee, K.C.⁵ Park, G.B.⁶ Lee, C.J.⁷ Moon, D.G.⁸ Han, G.I.⁹ Kim, Y.I.¹⁰ Nam, S.C.¹¹

6
- 51849154648
- 1549-3296
- K. V. Wolf, Z. Zong, J. Meng, A. Orana, N. Rahbar, K. M. Balss, G. Papandreou, C. A. Maryanoff, and W. O. Soboyejo, J. Biomed. Mater. Res. 87A, 272 (2008). 1549-3296
- (2008) J. Biomed. Mater. Res. , vol.87 , pp. 272
- Wolf, K.V.¹ Zong, Z.² Meng, J.³ Orana, A.⁴ Rahbar, N.⁵ Balss, K.M.⁶ Papandreou, G.⁷ Maryanoff, C.A.⁸ Soboyejo, W.O.⁹

7
- 0001419040
- 1549-3296
- W. F. Gorham, J. Polym. Sci. A-1 4, 3027 (1966). 1549-3296
- (1966) J. Polym. Sci. A-1 , vol.4 , pp. 3027
- Gorham, W.F.¹

8
- 0000469962
- 0950-1207 10.1098/rspa.1971.0141.
- K. L. Johnson, K. Kendall, and A. D. Roberts, Proc. R. Soc. London, Ser. A 0950-1207 10.1098/rspa.1971.0141 324, 301 (1971).
- (1971) Proc. R. Soc. London, Ser. A , vol.324 , pp. 301
- Johnson, K.L.¹ Kendall, K.² Roberts, A.D.³

9
- 33244484721
- 0021-9797 10.1016/0021-9797(75)90018-1.
- B. V. Derjaguin, V. M. Muller, and Y. P. Toporov, J. Colloid Interface Sci. 0021-9797 10.1016/0021-9797(75)90018-1 53, 314 (1975).
- (1975) J. Colloid Interface Sci. , vol.53 , pp. 314
- Derjaguin, B.V.¹ Muller, V.M.² Toporov, Y.P.³

10
- 33751360590
- 0021-9797 10.1016/0021-9797(92)90285-T.
- D. Maugis, J. Colloid Interface Sci. 0021-9797 10.1016/0021-9797(92) 90285-T 150, 243 (1992).
- (1992) J. Colloid Interface Sci. , vol.150 , pp. 243
- Maugis, D.¹

11
- 4344648818
- 0021-9797 10.1016/j.jcis.2004.06.029.
- N. Yu and A. A. Polycarpou, J. Colloid Interface Sci. 0021-9797 10.1016/j.jcis.2004.06.029 278, 428 (2004).
- (2004) J. Colloid Interface Sci. , vol.278 , pp. 428
- Yu, N.¹ Polycarpou, A.A.²

12
- 0025461953
- 0956-7151 10.1016/0956-7151(90)90200-Z.
- J. S. Wang and Z. Suo, Acta Metall. Mater. 0956-7151 10.1016/0956- 7151(90)90200-Z 38, 1279 (1990).
- (1990) Acta Metall. Mater. , vol.38 , pp. 1279
- Wang, J.S.¹ Suo, Z.²

13
- 0020115776
- 0376-9429
- C. Atkinson, R. E. Smelser, and J. Sanchez, Int. J. Fract. 18, 279 (1982). 0376-9429
- (1982) Int. J. Fract. , vol.18 , pp. 279
- Atkinson, C.¹ Smelser, R.E.² Sanchez, J.³

14
- 0024301167
- 0921-5093 10.1016/0921-5093(89)90382-1.
- Z. Suo and J. W. Hutchinson, Mater. Sci. Eng., A 0921-5093 10.1016/0921-5093(89)90382-1 107, 135 (1989).
- (1989) Mater. Sci. Eng., A , vol.107 , pp. 135
- Suo, Z.¹ Hutchinson, J.W.²

15
- 0001500013
- 0021-8936
- J. Dundurs, ASME J. Appl. Mech. 36, 650 (1969). 0021-8936
- (1969) ASME J. Appl. Mech. , vol.36 , pp. 650
- Dundurs, J.¹

16
- 57049155407
- 9th ed., (American Society for Metals, Metals Park, OH), Vol.,.
- Metals Handbook, 9th ed., (American Society for Metals, Metals Park, OH, 1990), Vol. 3, p. 755.
- (1990) Metals Handbook , vol.3 , pp. 755

17
- 57049121116
- Force imaging," Digital Instruments VMG, Support Note No. 228.
- "Force imaging," Digital Instruments VMG, Support Note No. 228, 1999.
- (1999)

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