메뉴 건너뛰기




Volumn , Issue , 2010, Pages 213-218

Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials

Author keywords

[No Author keywords available]

Indexed keywords

ACCURATE MEASUREMENT; BOND LINE; CHARACTERISATION; CURING PARAMETERS; CURING REGIMES; INTERFACE MATERIALS; PROCESS PARAMETERS; STEADY STATE TECHNIQUES; SURFACE FINISHES; TEST STANDS; THERMAL ADHESIVES; THERMAL BEHAVIOURS; THERMAL CHARACTERISATION; THERMAL INTERFACE MATERIALS; THERMAL INTERFACES; THERMAL MANAGEMENT; THERMAL MANAGEMENT SYSTEMS; THERMAL PROPERTIES;

EID: 78650470119     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (15)

References (7)
  • 2
    • 57649239296 scopus 로고    scopus 로고
    • In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features
    • Rome, Sept 24-26
    • B. Wunderle, J. Kleff, D. May, M. Abo Ras, R. Schacht, H.Oppermann, J. Keller and B. Michel. In-situ measurement of various thin Bond-Line-Thickness Thermal Interface Materials with Correlation to Structural Features. Proc 14th Therminic 2008, Rome, Sept 24-26 2008
    • (2008) Proc 14th Therminic 2008
    • Wunderle, B.1    Kleff, J.2    May, D.3    Abo Ras, M.4    Schacht, R.5    Oppermann, H.6    Keller, J.7    Michel, B.8


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.