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Volumn , Issue , 2010, Pages 213-218
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Influences of technological processing and surface finishes on thermal behaviour of thermal interface materials
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Author keywords
[No Author keywords available]
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Indexed keywords
ACCURATE MEASUREMENT;
BOND LINE;
CHARACTERISATION;
CURING PARAMETERS;
CURING REGIMES;
INTERFACE MATERIALS;
PROCESS PARAMETERS;
STEADY STATE TECHNIQUES;
SURFACE FINISHES;
TEST STANDS;
THERMAL ADHESIVES;
THERMAL BEHAVIOURS;
THERMAL CHARACTERISATION;
THERMAL INTERFACE MATERIALS;
THERMAL INTERFACES;
THERMAL MANAGEMENT;
THERMAL MANAGEMENT SYSTEMS;
THERMAL PROPERTIES;
CURING;
ELECTRONICS INDUSTRY;
SINTERING;
TEMPERATURE CONTROL;
THERMAL INSULATING MATERIALS;
THERMODYNAMIC PROPERTIES;
ELECTRONIC EQUIPMENT;
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EID: 78650470119
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (15)
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References (7)
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