Selective iterative etching of fused silica with gaseous hydrofluoric acid

Journal of Physical Chemistry C

Volumn 114, Issue 43, 2010, Pages 18712-18716

  Venturini, Francesco ^a   Navarrini, Walter ^a   Resnati, Giuseppe ^a   Metrangolo, Pierangelo ^a   Vazquez, Rebeca Martinez ^a   Osellame, Roberto ^a   Cerullo, Giulio ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ETCHING; DIFFUSION LIMITED; ETCHING PROCESS; ETCHING RATE; ETCHING STEP; ETCHING TECHNIQUE; FEMTOSECOND LASER IRRADIATION; GASPHASE; LIQUID HF; LIQUID PHASE; REACTION CHAMBERS; THREE-DIMENSIONAL MICROFLUIDICS;

FIBER OPTIC SENSORS; FUSED SILICA; HYDROFLUORIC ACID; LIQUIDS; MICROCHANNELS; SILICA;

WET ETCHING;

EID: 78650388433     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp107055s     Document Type: Article

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