Impact of exposure doses on demolding process in UV nanoimprint lithography

Journal of Vacuum Science and Technology B

Volumn 28, Issue 6, 2010, Pages 1239-1241

  Tanabe, Toshiaki ^a,b   Fujii, Noriyoshi ^a,b   Matsue, Masato ^a,b   Kawata, Hiroaki ^a,b   Hirai, Yoshihiko ^a,b  

^a Osaka Prefecture University   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; MOLDS; NANOIMPRINT LITHOGRAPHY; SILICA;

ADHESION FORCES; CHEMICAL CONVERSIONS; CONVERSION RATIO; DEMOLDING; EXPOSURE DOSE; HIGH-THROUGHPUT; LOW DOSAGE; UV DOSAGE; UV EXPOSURE; UV-NANOIMPRINT LITHOGRAPHY;

ELASTIC MODULI;

EID: 78650090462     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.3501126     Document Type: Article

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