A novel method for in situ uniaxial tests at the micro/nanoscalepart II: Experiment

Journal of Microelectromechanical Systems

Volumn 19, Issue 6, 2010, Pages 1322-1330

  Kang, Wonmo ^a   Han, Jong H ^a   Saif, M Taher A ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

Electron microscopy; materials testing; microassembly; microelectromechanical devices; strain measurement; stress measurement

Indexed keywords

AVERAGE STRAIN; BENDING STRAIN; IN-SITU; MECHANICAL MEASUREMENTS; MECHANICAL RESPONSE; MICRO-ELECTRO-MECHANICAL; MICROASSEMBLY; MISALIGNMENT ERRORS; NOVEL METHODS; SCANNING ELECTRON MICROSCOPES; SELF-ALIGNING; SINGLE CRYSTAL SILICON; SPECIMEN DESIGNS; UNIAXIAL TESTING; UNIAXIAL TESTS;

ALIGNMENT; INSTRUMENTS; MATERIALS TESTING; MICROELECTROMECHANICAL DEVICES; SCANNING ELECTRON MICROSCOPY; STRAIN GAGES; STRAIN MEASUREMENT;

STRESS MEASUREMENT;

EID: 78649640084     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2076782     Document Type: Article

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