Design and manufacturing of wideband buried RF feedthroughs for wafer-level RF MEMS package

European Microwave Week 2010: Connecting the World, EuMIC 2010 - Conference Proceedings

Volumn , Issue , 2010, Pages 321-324

  El Gannudi, H ^a   Farinelli, P ^a   Pieper, I ^b   Chiuppesi, E ^a   Sorrentino, R ^a  

^a UNIVERSITY OF PERUGIA   (Italy)

^b FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE LOSS; CPW LINE; FREQUENCY BAND WIDTH; GOLD RINGS; LOW LOSS; METAL SEALING; ON-WAFER; PARASITIC CAPACITANCE; RF APPLICATIONS; RF CHARACTERIZATION; RF MEASUREMENTS; RF PERFORMANCE; RF-MEMS; SIMULATED DATA; WAFER LEVEL; WIDE-BAND; ZERO-LEVEL PACKAGING;

ELECTRONICS PACKAGING; FREQUENCY BANDS; MANUFACTURE; SEALING (CLOSING);

WAFER BONDING;

EID: 78649618844     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. G. M. Rebeiz, J. B. Muldavin, "RF MEMS switches and swith circuits," in IEEE Microwave Magazine, vol. 2, no. 4, pp. 59-71, DC. 2001.
2. Pelzer R., Kirchberger H., Ketnner P., "Wafer-to-Wafer Bonding Techniques: From MEMS Packaging to IC Integration Applications", Proc 6th International Conference on Electronic Packaging Technology, August p2005, pp. 508-513.C
3. K.I. Kim, J. Mu Kim, J. Man Kim, G.C. Hwang, C.W. Baek, Y.K. Kim, "Packaging for RF-MEMS devices using LTCC substrate and BCB adhesive layer", Journal of Micromechanics and Microengineering. 16 (2005) 150-156.
4. Byung-Wook Min, G. M. Rebeiz, "A Low-Loss Silicon-on-Silicon DC-110 GHz Resonance-Free Package" IEEE Transactions on Microwave Theory and Techniques, Vol. 54, No. 2, pp. 710-716, Feb. 2006
5. th Electronic Components and Technology Conference, ECTC'07, June 2007, pp. 1239-1245.