Wafer-to-wafer bonding techniques: From MEMS packaging to IC integration applications

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages

  Pelzer, Rainer ^a   Kirchberger, Herwig ^a   Kettner, Paul ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; ELECTRONICS PACKAGING; EQUIPMENT TESTING; INTEGRATED CIRCUIT LAYOUT; MICROELECTROMECHANICAL DEVICES; MICROPROCESSOR CHIPS;

DEVICE STACKING; MINIATURIZATION; WAFER TO WAFER BONDING;

WSI CIRCUITS;

EID: 33846307757     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564704     Document Type: Conference Paper

References (3)

1. "Semiconductor Wafer Bonding: Science and Technology", Goesele, U., and Tong, Q.-Y., John Wiley and Sons, 1999.
2. Q.-Y. Tong and U. Gosele, Semiconductor Wafer-Bonding, John Wiley & Sons, New York, 1999.
3. Y. Kwon, J-Q. Lu, R.J. Gutmann, P.P. Kraft, J.F. McDonald and T.S. Cale, "Wafer bonding Using Low-K Dielectrics as Bonding Glue in Three-Dimensional Integration, The Electrochemical Society, 2001 Joint Meeting, September 2-7, 2001, San Francisco.