Nanomaterials for Electronic Packaging: Toward Extreme Miniaturization

IEEE Nanotechnology Magazine

Volumn 4, Issue 4, 2010, Pages 18-26

  Das, Rabindra N ^a   Markovich, Voya R ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC PACKAGING; EMBEDDED PASSIVES; LOW-K MATERIALS; NANO-MATERIALS; THERMAL INTERFACE MATERIALS;

NANOSTRUCTURED MATERIALS; THERMAL INSULATING MATERIALS;

ELECTRONICS PACKAGING;

EID: 78649554723     PISSN: 19324510     EISSN: None     Source Type: Journal    
DOI: 10.1109/MNANO.2010.938653     Document Type: Article

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