Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication and integration issues

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 17-24

  Ramesh, Sivarajan ^a,b   Shutzberg, Brad A ^a   Huang, Chester Chet ^c   Gao, Jie ^a   Giannelis, Emmanuel P ^a  

^a Cornell University   (United States)

^b RICE UNIVERSITY   (United States)

^c IBM MICROELECTRONICS   (United States)

Author keywords

Backscattering spectroscopy; Capacitor arrays; Ceramic core; Dielectric nanocomposites; Interface; Photolithographic; Polymer matrix; Thermal diffusion; Thin film capacitors; ULSI

Indexed keywords

BARIUM TITANATE; DIELECTRIC MATERIALS; HETEROJUNCTIONS; INORGANIC POLYMERS; INTERFACES (MATERIALS); NANOSTRUCTURED MATERIALS; PHOTOLITHOGRAPHY; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL DIFFUSION; THIN FILM DEVICES; ULSI CIRCUITS;

CAPACITOR ARRAYS; CERAMIC CORE; DIELECTRIC NANOCOMPOSITES; INTEGRAL THIN FILM CAPACITORS;

CAPACITORS;

EID: 0038618711     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811365     Document Type: Article

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