Effect of temperature on the evolution of diffusivity, microstructure and hardness of nanocrystalline nickel films electrodeposited at low temperatures

Materials Letters

Volumn 65, Issue 3, 2011, Pages 416-419

  Chung, C K ^a   Chang, W T ^a   Chen, C F ^a   Liao, M W ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Atomic force microscopy; Diffusion coefficient; Electrodeposition; Hardness; Nickel

Indexed keywords

ATOMIC FORCE MICROSCOPY; CORROSION; DEPOSITION RATES; DIFFUSION; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; HARDNESS; NANOCRYSTALS; NICKEL; RESIDUAL STRESSES;

COMPRESSIVE RESIDUAL STRESS; EFFECT OF TEMPERATURE; GALVANOSTATIC MODE; GALVANOSTATICALLY ELECTRODEPOSITED; HARDENING MECHANISM; LOW TEMPERATURES; NANO-CRYSTALLINE NICKEL; NI ELECTRODEPOSITION;

TEMPERATURE;

EID: 78649329529     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2010.10.064     Document Type: Article

References (13)

1. Penata O, Andrea T, Daniela K, Miriam G, Roger S. J Appl Electrochem 2006;36:957.
2. Jensen JAD, Pocwiardowskic P, Perssonb POA, Hultmanb L, Moller P. Chem Phys Lett 2003;368:732.
3. Chung CK, Chang WT. Microsyst Technol 2006;13:537.
4. Yuan X, Wang Y, Sun D, Yu H. Surf Coat Technol 2008;202:1895.
5. Chung CK, Chang WT. Thin Solid Films 2009;517:4800.
6. Oettel H, Wiedemann R. Surf Coat Technol 1995;76:265.
7. Chung CK, Peng CC, Wu BH, Chen TS. Surf Coat Technol 2007;202:1149.
8. Opallo M, Prokopowicz A. Electrochem Commun 2003;5:737.
9. Yu JX, Wang L, Su L, Ai XP, Yang HX. J Electrochem Soc 2003;150: C19.
10. Dolati A, Mahshid SS. Mater Chem Phys 2008;108:391.
11. Allen JB, Larry RF. Electrochemical methods fundamentals and applications. 2nd ed. New York: Wiley; 2001.
12. Sahari A, Azizi A, Schmerber G, Dinia A. Surf Rev Lett 2008;15:717.
13. William D, Callister Jr. Fundamentals of materials science and engineering. 2nd ed. NJ: John Wiley & Sons Inc.; 2005. p. 420-3.