Effect of pulse frequency on the morphology and nanoindentation property of electroplated nickel films

Microsystem Technologies

Volumn 13, Issue 5-6, 2007, Pages 537-541

  Chung, C K ^a   Chang, W T ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; GROWTH (MATERIALS); HARDNESS; MORPHOLOGY; NATURAL FREQUENCIES; NICKEL;

DC ELECTROPLATING; DEPOSITION RATE; NICKEL FILMS;

THIN FILMS;

EID: 33847253363     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0194-z     Document Type: Article

References (7)

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3. Ibanez A, Fatas E (2005) Mechanical and structural properties of electrodeposited copper and their relation with the electrode-position parameters. Surf Coat Tech 191:7-16
4. Qu NS, Chan KC, Zhu D (1997) Surface roughening in pulse current and pulse reverse current electroforming of nickel. Surf Coat Tech 91:220-224
5. Wong KP, Chan K, Yue TM (1999) A study of surface finishing in pulse current electroforming of nickel by utilizing different shaped waveforms. Surf Coat Tech 115:132-139
6. Wong KP, Chan KC, Yue TM (2000) Modelling the effect of complex waveform on surface finishing in pulse current electroforming of nickel. Surf Coat Tech 135:91-97
7. Yeh YM, Tu GC, Fang TH (2004) Nanomechnical properties of nanocrystalline Ni-Fe mold insert. J Alloys Compd 372:224-230