Influence of pulse parameters on the microstructure and microhardness of nickel electrodeposits

Surface and Coatings Technology

Volumn 202, Issue 9, 2008, Pages 1895-1903

  Xuetao, Yuan ^a   Yu, Wang ^a   Dongbai, Sun ^a,b   Hongying, Yu ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b Beijing Engineering Research Center for Surface Nano Technology   (China)

Author keywords

Microstructure; Nano effects; Pulse plating

Indexed keywords

CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CURRENT DENSITY; ELECTROLESS PLATING; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; MICROHARDNESS; PULSE MODULATION; SURFACE MORPHOLOGY;

PULSE PLATING; SQUARE-WAVE CATHODIC CURRENT MODULATION; WATTS BATH;

NICKEL PLATING;

CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; CURRENT DENSITY; ELECTROLESS PLATING; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; MICROHARDNESS; NICKEL PLATING; PULSE MODULATION; SURFACE MORPHOLOGY;

EID: 37349102377     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.08.023     Document Type: Article

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