A stress relief method for copper filled through silicon via with parylene on sidewall

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 98-101

  Kang, Wenping ^a   Zhang, Maosheng ^b   Zhu, Yunhui ^a   Ma, Shenglin ^a   Miao, Min ^a,b   Jin, Yufeng ^a  

^a PEKING UNIVERSITY   (China)

^b Beijing Key Laboratory of Advanced Information Science and Network Technology   (China)

Author keywords

[No Author keywords available]

Indexed keywords

LOW TEMPERATURES; LOW-TEMPERATURE PROCESS; PARYLENES; STRESS RELIEF METHOD; THERMAL STRESS DISTRIBUTIONS; THERMOMECHANICAL SIMULATION; THROUGH-SILICON-VIA;

ELECTRONICS PACKAGING; PACKAGING; STRESS CONCENTRATION; THERMAL STRESS; THERMOELASTICITY; THERMOMECHANICAL TREATMENT;

STRESS RELIEF;

EID: 78449288278     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582478     Document Type: Conference Paper

References (12)

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