Wafer Level Camera technology - From wafer level packaging to wafer level integration

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

Volumn , Issue , 2010, Pages 121-124

  Han, Hongtao ^a   Kriman, Moshe ^a   Boomgarden, Mark ^a  

^a Tessera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERA TECHNOLOGY; CELL PHONE; CONVENTIONAL DESIGN; ELECTRONIC DEVICE; FORM FACTORS; IMPROVED RELIABILITY; INJECTION MOLDED PLASTIC; MANUFACTURING COST; MOBILE ELECTRONICS; MODULE MANUFACTURING; ONE CAMERA; OPTICAL LENS; SMALL FORM FACTORS; WAFER LEVEL; WAFER LEVEL PACKAGING; WAFER-LEVEL INTEGRATION; WAFER-LEVEL PACKAGING TECHNOLOGY; WAFER-SCALE; WAFER-SCALE INTEGRATION; WAFERBONDING TECHNOLOGY;

APPROXIMATION THEORY; AUTOMOBILE ELECTRONIC EQUIPMENT; CAMERAS; CELLULAR TELEPHONE SYSTEMS; COSTS; DIGITAL CAMERAS; GLASS BONDING; IMAGE QUALITY; INJECTION MOLDING; INNOVATION; INTEGRATION; LAPTOP COMPUTERS; MANUFACTURE; MOBILE PHONES; OPTICAL INSTRUMENT LENSES; PACKAGING; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; TELEPHONE; TELEPHONE SETS; VIDEO CAMERAS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 78449270918     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2010.5582473     Document Type: Conference Paper

References (8)

1. Han, H. et al, " Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors," Presented at Asia Communications and Photonics Conference and Exhibition, Shanghai, November 2-6, 2009
2. Humpston, G. et al, "Low Cost Through Silicon Via Solution Compatible with Existing Assembly Infrastructure and Suitable for Single Die and Die Stacked Packages," IEEE International Microsystems, Packaging, Assembly & Circuits Technology Conference, Taipei, October 22-24, 2008
3. Humpston, G. "Novel and Low Cost Through Silicon Via Solution for Wafer Scale Packaging of Image Sensors," IEEE Electrical Design of Advanced Packaging and Systems Symposium, Seoul, December 10-12, 2008
4. Dagan, Y. "Wafer-level optics enables low cost camera phones," Proceedings of SPIE Volume 7218 "Integrated Optics: Devices, Materials, and Technologies XIII," February 9, 2009
5. Feldman, M. "Wafer-level camera technologies Shrink Camera Phone Handsets," Photonics Spectra, pp.58-60, August, 2007
6. Shin D. et al, "Fabrication of phone-camera module using wafer scale UV embossing process," Proc. of SPIE-IS&T Electronic Imaging, SPIE Vol. 6068, 2006
7. Rossi, M. et al, "Wafer-scale micro-optics replication technology," Proc. SPIE, Volume 5183, 2003, pp.140-154
8. Rudmann, H. et al, "Design and fabrication technologies for ultraviolet replicated micro-optics," Optical Engineering, Vol. 43, No. 11, 2004, pp. 2575-2582