Wafer-level optics enables low cost camera phones

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7218, Issue , 2009, Pages

  Dagan, Yehudit ^a  

^a NONE

Author keywords

Camera phone; VGA; Wafer level

Indexed keywords

CAMERA PHONE; COMPATIBLE MATERIALS; CONVENTIONAL CAMERA; CONVENTIONAL TECHNOLOGY; LOW COSTS; MARKET DEMAND; OPTICAL MODULES; VGA; WAFER LEVEL; WAFER-LEVEL CHIP SCALE PACKAGING;

CAMERAS; COMPUTER GENERATED HOLOGRAPHY; COSTS; DEVELOPING COUNTRIES; DIFFERENTIAL AMPLIFIERS; INTEGRATED OPTICS; MOBILE PHONES; OPTICAL MATERIALS; PACKAGING MATERIALS; PHOTONICS; TECHNOLOGY; TELEPHONE SETS; VIDEO AMPLIFIERS;

ELECTRONICS PACKAGING;

EID: 66749144978     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.811609     Document Type: Conference Paper

References (3)

1. Prismark, Camera Phones Market report, May 2008.
2. www.normankoren.com.
3. Image quality factors, Imatest (www.imatest.com).