Fabrication of phone-camera module using wafer-scale UV embossing process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6068, Issue , 2006, Pages

  Shin, Dong Ik ^a   Kim, Sung Hwa ^a   Jeong, Ho Seop ^a   Lee, Seokcheon ^a   Jin, Youngsu ^a   Noh, Jungeun ^a   Oh, Hyeran ^a   Lee, Kiun ^a   Shin, Dong Ho ^a   Song, Seok Ho ^b  

^a Samsung Electro Mechanics   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Lens module; Phone camera; UV embossing; Wafer scale replication

Indexed keywords

ARRAYS; COST EFFECTIVENESS; IMAGE SENSORS; LENSES; MICROPROCESSOR CHIPS; MOBILE TELECOMMUNICATION SYSTEMS; ULTRAVIOLET DETECTORS; WSI CIRCUITS;

LENS MODULE; PHONE-CAMERA; UV EMBOSSING; WAFER-SCALE REPLICATION;

CAMERAS;

EID: 33645687922     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.643461     Document Type: Conference Paper

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