Vibration characteristics of micromachined piezoelectric diaphragms with a standing beam subjected to airflow

Sensors and Actuators, A: Physical

Volumn 164, Issue 1-2, 2010, Pages 22-27

  Jing, X M ^a   Miao, J M ^a   Xu, T ^a   Olfatnia, M ^a   Norford, L ^b,c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE MIT ALLIANCE FOR RESEARCH AND TECHNOLOGY   (Singapore)

^c MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Airflow; Microdiaphragm; Piezoelectric MEMS; Vibration

Indexed keywords

AERODYNAMIC DRAG FORCE; AIRFLOW; CIRCUIT BOARDS; DEEP SILICON ETCHING; ELECTRICAL PROPERTY; ELECTRODE PADS; FLIP CHIP; FLIP-CHIP BONDING; FREQUENCY SHIFT; MECHANICAL STRAIN; MICRODIAPHRAGM; MICROMACHINED; MICROMACHINED DIAPHRAGM; MODE SHAPES; PB(ZR , TI)O; PIEZOELECTRIC DIAPHRAGMS; PIEZOELECTRIC MEMS; PZT; RESONANT FREQUENCIES; RESONANT FREQUENCY SHIFT; SENSOR CHIPS; SILICON BEAMS; SILICON MICROMACHINING; SOLDER BALLS; VIBRATION; VIBRATION CHARACTERISTICS; WIND SPEED; WIND TUNNEL TESTS;

AERODYNAMIC DRAG; AERODYNAMICS; ELECTRIC PROPERTIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FREQUENCY SHIFT KEYING; LEAD; NATURAL FREQUENCIES; PIEZOELECTRICITY; SOL-GEL PROCESS; WIND TUNNELS; ZIRCONIUM;

DIAPHRAGMS;

EID: 78249287247     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2010.09.017     Document Type: Article

References (12)

1. M. Tsai, K. Chen, and C. Wu Three-dimensional modeling of air flow and pollutant dispersion in an urban street canyon with thermal effects J. Air Waste Manage. Assoc. 55 2005 1178 1189
2. Y. Wang, C. Chen, C. Chang, C. Lin, C. Lin, L. Fu, and C. Lee MEMS-based gas flow sensors Microfluid Nanofluid 6 2009 333 346
3. T. Xu, Z. Wang, J. Miao, L. Yu, and C. Li Micro-machined piezoelectric membrane-based immunosensor array Biosens. Bioelectron. 24 2008 638 643
4. L. Wang, R. Wolf, Y. Wang, K.K. Deng, L. Zou, R. Davis, and S. Trolier-McKinstry Design, fabrication, and measurement of high-sensitivity piezoelectric microelectromechanical systems accelerometers J. Microelectromech. Syst. 12 2003 433 439
5. Z. Wang, J. Miao, and C.W. Tan Acoustic transducers with a perforated damping backplate based on PZT/silicon wafer bonding technique Sens. Actuators A 149 2009 277 283
6. M. Zarnik, D. Belavic, S. Macek, and J. Holc Feasibility study of a thick-film PZT resonant pressure sensor made on a prefired 3D LTCC structure Int. J. Appl. Ceram. Technol. 6 2009 9 17
7. K.H. Kim, and Y.H. Seo Self-resonant flow sensor using resonance frequency shift by flow-induced vibration IEEE Int. Conf. Microelectromech. Syst. 2009 511 514
8. M. Olfatnia, J. Miao, L. Ong, T. Xu, and Z. Wang Investigation of residual stress and its effects on the vibrational characteristics of piezoelectric-based multilayered microdiaphragms J. Micromech. Microeng. 20 2009 015007
9. W. Young, and R. Budynas Roark's Formulas for Stress and Strain 2002 McGraw-Hill
10. C. Calgaro, J. Coulombel, and T. Goudon Analysis and Simulation of Fluid Dynamics 2007 Birkhäuser Basel
11. X.M. Jing, D. Chen, D.M. Fang, C. Huang, J.Q. Liu, and X. Chen Multi-layer microstructure fabrication by combining bulk silicon micromachining and UV-LIGA technique Microelectron. J. 38 2007 120 124
12. H. Schlichting, and K. Gersten Boundary Layer Theory 2003 Springer