Acoustic transducers with a perforated damping backplate based on PZT/silicon wafer bonding technique

Sensors and Actuators, A: Physical

Volumn 149, Issue 2, 2009, Pages 277-283

  Wang, Zhihong ^a   Miao, Jianmin ^a   Tan, Chee Wee ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Acoustic transducer; Perforated damping backplate; Piezoelectric MEMS; PZT Si wafer bonding

Indexed keywords

ACOUSTIC TRANSDUCERS; ACOUSTICS; BONDING; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DAMPING; FABRICATION; LEAD; MEMS; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC ACTUATORS; PIEZOELECTRIC CERAMICS; PIEZOELECTRIC MATERIALS; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; REACTIVE ION ETCHING; SEMICONDUCTING LEAD COMPOUNDS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TRANSDUCERS; ZIRCONIUM;

ACOUSTIC FREQUENCIES; ACOUSTIC TRANSDUCER; BULK- MICROMACHINING; DEEP REACTIVE ION ETCHINGS; HIGH QUALITIES; INTEGRATED TRANSDUCERS; KEY TECHNIQUES; LOW-TEMPERATURE BONDINGS; MEASUREMENT RESULTS; PB(ZR ,TI)O; PERFORATED DAMPING BACKPLATE; PIEZOELECTRIC MEMS; PZT; PZT/SI WAFER BONDING; SILICON ON INSULATORS; SOI-WAFERS; SPIN-ON; WAFER BONDING TECHNIQUES;

WAFER BONDING;

EID: 58949083660     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.11.012     Document Type: Article

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